There are no models available for this part yet.
Overview of XCS40-3BG256C by AMD Xilinx
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 4 listings )
- Number of FFF Equivalents: ( 2 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 7 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for XCS40-3BG256C by AMD Xilinx
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
Bristol Electronics | 32 |
|
RFQ | ||||
Quest Components | Field-Programmable Gate Array, 784 Cell, 256 Pin, Plastic, BGA | 25 |
|
$108.8000 / $136.0000 | Buy Now | ||
Quest Components | Field-Programmable Gate Array, 784 Cell, 256 Pin, Plastic, BGA | 10 |
|
$55.7750 / $58.0060 | Buy Now | ||
Quest Components | Field-Programmable Gate Array, 784 Cell, 256 Pin, Plastic, BGA | 8 |
|
$115.6000 / $136.0000 | Buy Now |
CAD Models for XCS40-3BG256C by AMD Xilinx
Part Data Attributes for XCS40-3BG256C by AMD Xilinx
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
XILINX INC
|
Part Package Code
|
BGA
|
Package Description
|
PLASTIC, BGA-256
|
Pin Count
|
256
|
Reach Compliance Code
|
not_compliant
|
HTS Code
|
8542.39.00.01
|
Additional Feature
|
MAXIMUM USABLE GATES 40000
|
Clock Frequency-Max
|
125 MHz
|
Combinatorial Delay of a CLB-Max
|
1.6 ns
|
JESD-30 Code
|
S-PBGA-B256
|
JESD-609 Code
|
e0
|
Length
|
27 mm
|
Moisture Sensitivity Level
|
3
|
Number of CLBs
|
784
|
Number of Equivalent Gates
|
13000
|
Number of Inputs
|
205
|
Number of Logic Cells
|
784
|
Number of Outputs
|
205
|
Number of Terminals
|
256
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
|
Organization
|
784 CLBS, 13000 GATES
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA256,20X20,50
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
225
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
2.55 mm
|
Supply Voltage-Max
|
5.25 V
|
Supply Voltage-Min
|
4.75 V
|
Supply Voltage-Nom
|
5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
OTHER
|
Terminal Finish
|
Tin/Lead (Sn63Pb37)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
27 mm
|
Alternate Parts for XCS40-3BG256C
This table gives cross-reference parts and alternative options found for XCS40-3BG256C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCS40-3BG256C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
XCS40-3BGG256C | Field Programmable Gate Array, 784 CLBs, 13000 Gates, 125MHz, CMOS, PBGA256, PLASTIC, BGA-256 | AMD Xilinx | XCS40-3BG256C vs XCS40-3BGG256C |
XCS40-3BGG256I | Field Programmable Gate Array, 784 CLBs, 13000 Gates, PBGA256, PLASTIC, BGA-256 | AMD Xilinx | XCS40-3BG256C vs XCS40-3BGG256I |
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