Part Details for XCVC1502-2MSIVSVA2197 by AMD
Overview of XCVC1502-2MSIVSVA2197 by AMD
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XCVC1502-2MSIVSVA2197
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
122-XCVC1502-2MSIVSVA2197-ND
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DigiKey | IC VERSAL AI-CORE FPGA 2197BGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$26,593.7500 | Buy Now |
DISTI #
XCVC1502-2MSIVSVA2
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Avnet Americas | XCVC1502-2MSIVSVA2197 - Bulk (Alt: XCVC1502-2MSIVSVA2) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Bulk | 0 |
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RFQ |
Part Details for XCVC1502-2MSIVSVA2197
XCVC1502-2MSIVSVA2197 CAD Models
XCVC1502-2MSIVSVA2197 Part Data Attributes
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XCVC1502-2MSIVSVA2197
AMD
Buy Now
Datasheet
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XCVC1502-2MSIVSVA2197
AMD
Microprocessor Circuit, CMOS, PBGA2197, FCBGA-2197
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | FCBGA-2197 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 16 Weeks | |
JESD-30 Code | S-PBGA-B2197 | |
JESD-609 Code | e1 | |
Length | 45 mm | |
Number of Terminals | 2197 | |
Operating Temperature-Max | 110 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA2197,47X47,36 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Seated Height-Max | 4 mm | |
Supply Voltage-Max | 0.825 V | |
Supply Voltage-Min | 0.775 V | |
Supply Voltage-Nom | 0.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.92 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |