There are no models available for this part yet.
Overview of XCVC1802-2HSIVIVA1596 by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for XCVC1802-2HSIVIVA1596 by AMD
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
122-XCVC1802-2HSIVIVA1596-ND
|
DigiKey | IC VERSAL AI-CORE FPGA 1596BGA Min Qty: 1 Lead time: 21 Weeks Container: Tray | Temporarily Out of Stock |
|
$37,183.7500 | Buy Now | |
DISTI #
XCVC1802-2HSIVIVA1
|
Avnet Americas | Adaptive Compute Acceleration Platform 1150MHz 0.88V 1596-Pin BGA Tray - Bulk (Alt: XCVC1802-2HSIVIVA1) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 20 Weeks, 0 Days Container: Bulk | 0 |
|
RFQ |
CAD Models for XCVC1802-2HSIVIVA1596 by AMD
Part Data Attributes for XCVC1802-2HSIVIVA1596 by AMD
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
Package Description
|
FCBGA-1596
|
Reach Compliance Code
|
compliant
|
Factory Lead Time
|
20 Weeks
|
JESD-30 Code
|
S-PBGA-B1596
|
Length
|
40 mm
|
Number of Terminals
|
1596
|
Operating Temperature-Max
|
110 °C
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
HBGA
|
Package Equivalence Code
|
BGA1596,40X40,36
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, HEAT SINK/SLUG
|
Seated Height-Max
|
4 mm
|
Supply Voltage-Max
|
0.906 V
|
Supply Voltage-Min
|
0.854 V
|
Supply Voltage-Nom
|
0.88 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.92 mm
|
Terminal Position
|
BOTTOM
|
Width
|
40 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR CIRCUIT
|