Datasheets
XCVH1542-2MSEVSVA3697 by:

Microprocessor Circuit, CMOS, PBGA3697, FCBGA-3697

Part Details for XCVH1542-2MSEVSVA3697 by AMD

Results Overview of XCVH1542-2MSEVSVA3697 by AMD

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XCVH1542-2MSEVSVA3697 Information

XCVH1542-2MSEVSVA3697 by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for XCVH1542-2MSEVSVA3697

Part # Distributor Description Stock Price Buy
DISTI # XCVH1542-2MSEVSVA3697
Avnet Americas Adaptive Compute Acceleration Platform, Versal VH1542, 800 mV, 3697-Pin, BGA - Bulk (Alt: XCVH1542-2MSEVSVA3697) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 30 Weeks, 0 Days Container: Bulk 20
RFQ
DISTI # XCVH1542-2MSEVSVA3697
Avnet Silica Adaptive Compute Acceleration Platform Versal VH1542 800 mV 3697Pin BGA (Alt: XCVH1542-2MSEVSVA3697) RoHS: Compliant Min Qty: 1 Package Multiple: 10 Lead time: 27 Weeks, 0 Days Silica - 0
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Part Details for XCVH1542-2MSEVSVA3697

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XCVH1542-2MSEVSVA3697 Part Data Attributes

XCVH1542-2MSEVSVA3697 AMD
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Compare Parts:
XCVH1542-2MSEVSVA3697 AMD Microprocessor Circuit, CMOS, PBGA3697, FCBGA-3697
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FCBGA-3697
Reach Compliance Code compliant
Factory Lead Time 30 Weeks
JESD-30 Code S-PBGA-B3697
Number of Terminals 3697
Operating Temperature-Max 110 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 0.825 V
Supply Voltage-Min 0.775 V
Supply Voltage-Nom 0.8 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Position BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

XCVH1542-2MSEVSVA3697 Frequently Asked Questions (FAQ)

  • The recommended PCB layout for optimal thermal performance can be found in the application note or design guide provided by the manufacturer. It typically includes guidelines for thermal vias, heat sinks, and component placement.

  • To troubleshoot issues with the power-on reset circuitry, check the power supply voltage, ensure proper decoupling, and verify the reset pin connections. Also, consult the device's errata sheet and application notes for specific guidance.

  • The recommended settings for the device's clock configuration can be found in the device's datasheet or application note. It typically includes information on clock frequencies, clock sources, and clock distribution.

  • To optimize the device's power consumption, use the power-saving features provided by the device, such as clock gating, power gating, and dynamic voltage and frequency scaling. Also, consider using low-power modes, reducing clock frequencies, and optimizing the system's power management.

  • The limitations of the device's I/O interfaces can be found in the device's datasheet or application note. Common limitations include bandwidth, latency, and signal integrity issues. To work around these limitations, consider using interface-specific IP cores, optimizing the interface's configuration, and using signal conditioning circuits.

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