Datasheets
XCVM1302-2MSENBVB1024 by:

Microprocessor Circuit, CMOS, PBGA1024, FCBGA-1024

Part Details for XCVM1302-2MSENBVB1024 by AMD

Overview of XCVM1302-2MSENBVB1024 by AMD

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Price & Stock for XCVM1302-2MSENBVB1024

Part # Distributor Description Stock Price Buy
DISTI # 122-XCVM1302-2MSENBVB1024-ND
DigiKey IC VERSALPRIME ACAP FPGA 1024BGA Min Qty: 1 Lead time: 16 Weeks Container: Tray Temporarily Out of Stock
  • 1 $4,091.2500
$4,091.2500 Buy Now
DISTI # XCVM1302-2MSENBVB1
Avnet Americas XCVM1302-2MSENBVB1024 - Bulk (Alt: XCVM1302-2MSENBVB1) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Bulk 0
  • 1 $4,140.3450
$4,140.3450 Buy Now
DISTI # 217-13022MSENBVB1024
Mouser Electronics SoC FPGA XCVM1302-2MSENBVB1024 RoHS: Compliant 0
  • 1 $4,025.3300
$4,025.3300 Order Now

Part Details for XCVM1302-2MSENBVB1024

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XCVM1302-2MSENBVB1024 Part Data Attributes

XCVM1302-2MSENBVB1024 AMD
Buy Now Datasheet
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XCVM1302-2MSENBVB1024 AMD Microprocessor Circuit, CMOS, PBGA1024, FCBGA-1024
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FCBGA-1024
Reach Compliance Code compliant
Factory Lead Time 16 Weeks
JESD-30 Code S-PBGA-B1024
Length 31 mm
Number of Terminals 1024
Operating Temperature-Max 110 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA1024,32X32,36
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Seated Height-Max 2.94 mm
Supply Voltage-Max 0.825 V
Supply Voltage-Min 0.775 V
Supply Voltage-Nom 0.8 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 0.92 mm
Terminal Position BOTTOM
Width 31 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

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