There are no models available for this part yet.
Overview of XCVM1302-2MSINSVF1369 by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for XCVM1302-2MSINSVF1369 by AMD
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
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DISTI #
122-XCVM1302-2MSINSVF1369-ND
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DigiKey | IC VERSALPRIME ACAP FPGA 1369BGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
|
$5,317.5000 | Buy Now | |
|
DISTI #
XCVM1302-2MSINSVF1
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Avnet Americas | XCVM1302-2MSINSVF1369 - Bulk (Alt: XCVM1302-2MSINSVF1) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Bulk | 0 |
|
$5,381.3100 | Buy Now | |
|
DISTI #
217-13022MSINSVF1369
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Mouser Electronics | SoC FPGA XCVM1302-2MSINSVF1369 RoHS: Compliant | 0 |
|
$5,231.8200 | Order Now |
CAD Models for XCVM1302-2MSINSVF1369 by AMD
Part Data Attributes for XCVM1302-2MSINSVF1369 by AMD
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|
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|---|---|
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Rohs Code
|
Yes
|
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Part Life Cycle Code
|
Active
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Ihs Manufacturer
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ADVANCED MICRO DEVICES INC
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Package Description
|
FCBGA-1369
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Reach Compliance Code
|
compliant
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Factory Lead Time
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16 Weeks
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JESD-30 Code
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S-PBGA-B1369
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Length
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35 mm
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Number of Terminals
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1369
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Operating Temperature-Max
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110 °C
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Operating Temperature-Min
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-40 °C
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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HBGA
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Package Equivalence Code
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BGA1369,37X37,36
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY, HEAT SINK/SLUG
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Seated Height-Max
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4 mm
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Supply Voltage-Max
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0.825 V
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Supply Voltage-Min
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0.775 V
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Supply Voltage-Nom
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0.8 V
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Surface Mount
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YES
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Technology
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CMOS
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Terminal Form
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BALL
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Terminal Pitch
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0.92 mm
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Terminal Position
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BOTTOM
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Width
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35 mm
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uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR CIRCUIT
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