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Part Details for XCZU19EG-2FFVC1760E by AMD
Overview of XCZU19EG-2FFVC1760E by AMD
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for XCZU19EG-2FFVC1760E
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
XCZU19EG-2FFVC1760E-ND
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DigiKey | IC SOC CORTEX-A53 1760FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray |
1 In Stock |
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$9,021.2500 | Buy Now |
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DISTI #
XCZU19EG-2FFVC1760
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Avnet Americas | XLXXCZU19EG-2FFVC1760E ZYNQ ULTRASCALE - Trays (Alt: XCZU19EG-2FFVC1760) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
217-U19EG-2FFVC1760E
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Mouser Electronics | SoC FPGA XCZU19EG-2FFVC1760E RoHS: Compliant | 0 |
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$8,875.9000 | Order Now |
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Win Source Electronics | IC SOC CORTEX-A53 1760FCBGA / Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC series Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1760-FCBGA (42.5x42.5) | 200 |
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$791.3050 | Buy Now |
Part Details for XCZU19EG-2FFVC1760E
XCZU19EG-2FFVC1760E CAD Models
XCZU19EG-2FFVC1760E Part Data Attributes
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XCZU19EG-2FFVC1760E
AMD
Buy Now
Datasheet
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Compare Parts:
XCZU19EG-2FFVC1760E
AMD
Microprocessor Circuit, CMOS, PBGA1760, FCBGA-1760
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FCBGA-1760 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| JESD-30 Code | R-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Length | 42.5 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 1760 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Seated Height-Max | 3.71 mm | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |