Part Details for XCZU4EG-2FBVB900E by AMD Xilinx
Overview of XCZU4EG-2FBVB900E by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Price & Stock for XCZU4EG-2FBVB900E
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
SMC-XCZU4EG-2FBVB900E
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Sensible Micro Corporation | AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days | 3 |
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RFQ |
Part Details for XCZU4EG-2FBVB900E
XCZU4EG-2FBVB900E CAD Models
XCZU4EG-2FBVB900E Part Data Attributes
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XCZU4EG-2FBVB900E
AMD Xilinx
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Datasheet
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XCZU4EG-2FBVB900E
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA900, FCBGA-900
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 52 Weeks | |
Date Of Intro | 2017-02-15 | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Length | 31 mm | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 900 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Seated Height-Max | 2.88 mm | |
Supply Voltage-Max | 0.876 V | |
Supply Voltage-Min | 0.825 V | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 31 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |