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Part Details for XCZU7EV-2FBVB900I by AMD
Overview of XCZU7EV-2FBVB900I by AMD
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for XCZU7EV-2FBVB900I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
XCZU7EV-2FBVB900I-ND
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DigiKey | IC SOC CORTEX-A53 900FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$4,685.0000 | Buy Now |
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DISTI #
XCZU7EV-2FBVB900I
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Avnet Americas | FPGA Zynq UltraScale+ Family 504000 Cells 20nm Technology 0.95V 900-Pin FC-BGA Tray - Trays (Alt: XCZU7EV-2FBVB900I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
XCZU7EV-2FBVB900I
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Avnet Americas | FPGA Zynq UltraScale+ Family 504000 Cells 20nm Technology 0.95V 900-Pin FC-BGA Tray - Trays (Alt: XCZU7EV-2FBVB900I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$4,441.3800 / $4,741.2200 | Buy Now |
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DISTI #
217-CZU7EV-2FBVB900I
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Mouser Electronics | SoC FPGA XCZU7EV-2FBVB900I RoHS: Compliant | 9 |
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$4,609.5100 | Buy Now |
Part Details for XCZU7EV-2FBVB900I
XCZU7EV-2FBVB900I CAD Models
XCZU7EV-2FBVB900I Part Data Attributes
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XCZU7EV-2FBVB900I
AMD
Buy Now
Datasheet
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Compare Parts:
XCZU7EV-2FBVB900I
AMD
Microprocessor Circuit, CMOS, PBGA900, FCBGA-900
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |