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Microprocessor Circuit, CMOS, PBGA1156, FCBGA-1156
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XCZU7EV-2FFVC1156E-ND
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DigiKey | IC SOC CORTEX-A53 1156FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$4,550.0000 | Buy Now |
DISTI #
XCZU7EV-2FFVC1156E
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Avnet Americas | System On Chip Processor, Zynq UltraScale+, ARM Cortex-A53, ARM Cortex-R5F, 1.5 GHz, FCBGA, 1156 Pins - Trays (Alt: XCZU7EV-2FFVC1156E) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$4,313.4000 / $4,604.6000 | Buy Now |
DISTI #
XCZU7EV-2FFVC1156E
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Avnet Americas | System On Chip Processor, Zynq UltraScale+, ARM Cortex-A53, ARM Cortex-R5F, 1.5 GHz, FCBGA, 1156 Pins - Trays (Alt: XCZU7EV-2FFVC1156E) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$4,604.6000 | Buy Now |
DISTI #
217-ZU7EV-2FFVC1156E
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Mouser Electronics | SoC FPGA XCZU7EV-2FFVC1156E RoHS: Compliant | 2 |
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$4,513.6500 | Buy Now |
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Win Source Electronics | IC SOC CORTEX-A53 1156FCBGA / Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC series Zynq®UltraScale+™ FPGA, 504K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35) | 400 |
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$442.7540 | Buy Now |
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XCZU7EV-2FFVC1156E
AMD
Buy Now
Datasheet
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Compare Parts:
XCZU7EV-2FFVC1156E
AMD
Microprocessor Circuit, CMOS, PBGA1156, FCBGA-1156
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | FCBGA-1156 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | AMD | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Length | 35 mm | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 1156 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Seated Height-Max | 3.51 mm | |
Supply Voltage-Max | 0.876 V | |
Supply Voltage-Min | 0.825 V | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |