Datasheets
XCZU9CG-2FFVC900E by:

Microprocessor Circuit, CMOS, PBGA900, FCBGA-900

Part Details for XCZU9CG-2FFVC900E by AMD Xilinx

Results Overview of XCZU9CG-2FFVC900E by AMD Xilinx

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XCZU9CG-2FFVC900E Information

XCZU9CG-2FFVC900E by AMD Xilinx is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Part Details for XCZU9CG-2FFVC900E

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XCZU9CG-2FFVC900E Part Data Attributes

XCZU9CG-2FFVC900E AMD Xilinx
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XCZU9CG-2FFVC900E AMD Xilinx Microprocessor Circuit, CMOS, PBGA900, FCBGA-900
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description FCBGA-900
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Factory Lead Time 52 Weeks
Date Of Intro 2017-02-15
JESD-30 Code S-PBGA-B900
JESD-609 Code e1
Length 31 mm
Moisture Sensitivity Level 4
Number of Terminals 900
Operating Temperature-Max 100 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Seated Height-Max 3.42 mm
Supply Voltage-Max 0.876 V
Supply Voltage-Min 0.825 V
Supply Voltage-Nom 0.85 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 31 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

XCZU9CG-2FFVC900E Related Parts

XCZU9CG-2FFVC900E Frequently Asked Questions (FAQ)

  • The maximum power consumption of XCZU9CG-2FFVC900E is around 12W, but it can vary depending on the usage and configuration of the device.

  • To optimize power consumption, you can use power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling. You can also use the Xilinx Power Estimator (XPE) tool to estimate and optimize power consumption.

  • The maximum operating temperature of XCZU9CG-2FFVC900E is 100°C (junction temperature) and 85°C (ambient temperature).

  • To ensure signal integrity, you should follow proper PCB design guidelines, use signal termination and buffering, and optimize signal routing. You can also use the Xilinx Signal Integrity (SI) tool to analyze and optimize signal integrity.

  • The maximum bandwidth of the PCIe interface in XCZU9CG-2FFVC900E is 16 GT/s (gigatransfers per second) per lane, with a maximum of 16 lanes.

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