Part Details for XCZU9CG-2FFVC900E by AMD Xilinx
Results Overview of XCZU9CG-2FFVC900E by AMD Xilinx
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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XCZU9CG-2FFVC900E Information
XCZU9CG-2FFVC900E by AMD Xilinx is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for XCZU9CG-2FFVC900E
XCZU9CG-2FFVC900E CAD Models
XCZU9CG-2FFVC900E Part Data Attributes
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XCZU9CG-2FFVC900E
AMD Xilinx
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Datasheet
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XCZU9CG-2FFVC900E
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA900, FCBGA-900
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-900 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 52 Weeks | |
Date Of Intro | 2017-02-15 | |
JESD-30 Code | S-PBGA-B900 | |
JESD-609 Code | e1 | |
Length | 31 mm | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 900 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Seated Height-Max | 3.42 mm | |
Supply Voltage-Max | 0.876 V | |
Supply Voltage-Min | 0.825 V | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 31 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |