Part Details for XCZU9CG-2FFVC900I by AMD
Results Overview of XCZU9CG-2FFVC900I by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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XCZU9CG-2FFVC900I Information
XCZU9CG-2FFVC900I by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XCZU9CG-2FFVC900I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XCZU9CG-2FFVC900I
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Avnet Americas | FPGA Zynq UltraScale+ Family 599550 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray - Trays (Alt: XCZU9CG-2FFVC900I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$4,498.6216 | Buy Now |
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DISTI #
XCZU9CG-2FFVC900I
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Avnet Silica | FPGA Zynq UltraScale Family 599550 Cells 20nm Technology 085V 900Pin FCBGA Tray (Alt: XCZU9CG-2FFVC900I) RoHS: Compliant Min Qty: 1 Package Multiple: 27 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
XCZU9CG-2FFVC900I
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EBV Elektronik | FPGA Zynq UltraScale Family 599550 Cells 20nm Technology 085V 900Pin FCBGA Tray (Alt: XCZU9CG-2FFVC900I) RoHS: Compliant Min Qty: 1 Package Multiple: 27 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for XCZU9CG-2FFVC900I
XCZU9CG-2FFVC900I CAD Models
XCZU9CG-2FFVC900I Part Data Attributes
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XCZU9CG-2FFVC900I
AMD
Buy Now
Datasheet
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Compare Parts:
XCZU9CG-2FFVC900I
AMD
Microprocessor Circuit, CMOS, PBGA900, FCBGA-900
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |