Datasheets
XCZU9CG-2FFVC900I by:

Microprocessor Circuit, CMOS, PBGA900, FLIPCHIP-900

Part Details for XCZU9CG-2FFVC900I by AMD Xilinx

Results Overview of XCZU9CG-2FFVC900I by AMD Xilinx

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XCZU9CG-2FFVC900I Information

XCZU9CG-2FFVC900I by AMD Xilinx is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Part Details for XCZU9CG-2FFVC900I

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XCZU9CG-2FFVC900I Part Data Attributes

XCZU9CG-2FFVC900I AMD Xilinx
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XCZU9CG-2FFVC900I AMD Xilinx Microprocessor Circuit, CMOS, PBGA900, FLIPCHIP-900
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description FCBGA-900
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Factory Lead Time 52 Weeks
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Number of Terminals 900
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Supply Voltage-Max 0.876 V
Supply Voltage-Min 0.825 V
Supply Voltage-Nom 0.85 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

XCZU9CG-2FFVC900I Related Parts

XCZU9CG-2FFVC900I Frequently Asked Questions (FAQ)

  • The maximum power consumption of XCZU9CG-2FFVC900I is approximately 12W, but it can vary depending on the specific use case and operating conditions.

  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.

  • The maximum operating temperature of XCZU9CG-2FFVC900I is 100°C (industrial grade) or 125°C (extended grade).

  • To ensure signal integrity, follow the Xilinx PCB design guidelines, use controlled impedance traces, and add termination resistors as needed. Also, use the Xilinx Signal Integrity Tool (SIT) to analyze and optimize signal integrity.

  • The maximum frequency of the XCZU9CG-2FFVC900I depends on the specific device configuration and operating conditions, but it can reach up to 500 MHz for the ARM Cortex-A53 processor and up to 1.2 GHz for the programmable logic.

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