There are no models available for this part yet.
Overview of XPC860ENCZP50D3 by Motorola Semiconductor Products
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for XPC860ENCZP50D3 by Motorola Semiconductor Products
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
2156-XPC860ENCZP50D3-ND
|
DigiKey | IC MPU MPC86XX 50MHZ 357BGA Min Qty: 7 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
8130 In Stock |
|
$45.7800 | Buy Now | |
Quest Components | 32-BIT, 50 MHZ, RISC PROCESSOR, PBGA357 | 15 |
|
$53.0415 / $58.9350 | Buy Now |
CAD Models for XPC860ENCZP50D3 by Motorola Semiconductor Products
Part Data Attributes for XPC860ENCZP50D3 by Motorola Semiconductor Products
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
MOTOROLA INC
|
Package Description
|
PLASTIC, BGA-357
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
3A991.A.2
|
HTS Code
|
8542.31.00.01
|
Address Bus Width
|
32
|
Bit Size
|
32
|
Boundary Scan
|
YES
|
Clock Frequency-Max
|
50 MHz
|
External Data Bus Width
|
32
|
Format
|
FIXED POINT
|
Integrated Cache
|
YES
|
JESD-30 Code
|
S-PBGA-B357
|
JESD-609 Code
|
e0
|
Length
|
25 mm
|
Low Power Mode
|
YES
|
Number of Terminals
|
357
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
2.05 mm
|
Speed
|
50 MHz
|
Supply Voltage-Max
|
3.465 V
|
Supply Voltage-Min
|
3.135 V
|
Supply Voltage-Nom
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
BOTTOM
|
Width
|
25 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
|
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