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Microcontrollers and Processors / Serial IO/Communication Controllers / XR20M1172IL32-F
Datasheets
XR20M1172IL32-F by:

I2C Bus Controller, 2 Channel(s), 2MBps, CMOS, QFN-32

Part Details for XR20M1172IL32-F by MaxLinear Inc

Results Overview of XR20M1172IL32-F by MaxLinear Inc

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XR20M1172IL32-F Information

XR20M1172IL32-F by MaxLinear Inc is a Serial IO/Communication Controller.
Serial IO/Communication Controllers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for XR20M1172IL32-F

Part # Distributor Description Stock Price Buy
DISTI # XR20M1172IL32-F
Avnet Americas 1.62 TO 3.6V I2C/SPI DUART WITH 64-BYTE - Trays (Alt: XR20M1172IL32-F) Min Qty: 490 Package Multiple: 490 Lead time: 20 Weeks, 0 Days Container: Tray 0
  • 490 $4.7752
  • 980 $4.6624
  • 1,960 $4.5496
  • 2,940 $4.4368
  • 3,920 $4.3240
$4.3240 / $4.7752 Buy Now

Part Details for XR20M1172IL32-F

XR20M1172IL32-F CAD Models

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XR20M1172IL32-F Part Data Attributes

Parametric Data
XR20M1172IL32-F MaxLinear Inc
Buy Now Datasheet
Compare Parts:
XR20M1172IL32-F MaxLinear Inc I2C Bus Controller, 2 Channel(s), 2MBps, CMOS, QFN-32
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer MAXLINEAR INC
Reach Compliance Code compliant
HTS Code 8542.31.00.01
Factory Lead Time 20 Weeks
Samacsys Manufacturer MaxLinear, Inc.
Address Bus Width 2
Boundary Scan NO
Clock Frequency-Max 24 MHz
Communication Protocol I2C
Data Encoding/Decoding Method NRZ
Data Transfer Rate-Max 2 MBps
External Data Bus Width
JESD-30 Code S-XQCC-N32
JESD-609 Code e3
Length 5 mm
Low Power Mode YES
Moisture Sensitivity Level 1
Number of Serial I/Os 2
Number of Terminals 32
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max 3.63 V
Supply Voltage-Min 1.62 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Width 5 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Alternate Parts for XR20M1172IL32-F

This table gives cross-reference parts and alternative options found for XR20M1172IL32-F. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XR20M1172IL32-F, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XR20M1172IL32-F Exar Corporation Check for Price I2C Bus Controller, 2 Channel(s), 2MBps, CMOS, 5 X 5 MM, 0.90 MM HEIGHT, GREEN, QFN-32 XR20M1172IL32-F vs XR20M1172IL32-F
XR20M1172IG28 Exar Corporation Check for Price I2C Bus Controller, 8 Channel(s), 2MBps, CMOS, PDSO28, 4.40 MM, TSSOP-28 XR20M1172IL32-F vs XR20M1172IG28

XR20M1172IL32-F Related Parts

XR20M1172IL32-F Frequently Asked Questions (FAQ)

  • For optimal performance, it's recommended to follow the PCB layout guidelines provided in the application note AN-215. Ensure a solid ground plane, use thermal vias, and keep the device away from heat sources. A 4-layer PCB with a dedicated ground plane is recommended.

  • To ensure reliable operation, follow the recommended operating conditions, and consider the device's thermal characteristics. Implement thermal monitoring and shutdown mechanisms to prevent overheating. Also, ensure the device is properly soldered and the PCB is designed for thermal dissipation.

  • For optimal signal integrity, use a 50-ohm transmission line for input and output signals. Implement a source-terminated topology for the input, and a far-end termination for the output. Refer to the application note AN-215 for detailed termination schemes.

  • For troubleshooting, use a logic analyzer or oscilloscope to monitor the device's signals. Check the power supply, clock, and data signals for any anomalies. Refer to the datasheet and application notes for troubleshooting guidelines and common issues.

  • Ensure a clean and stable power supply with a minimum of 1.71V and a maximum of 1.89V. Follow the recommended power sequencing: VCC, then VCCIO, and finally the clock signal. Refer to the datasheet for detailed power-up and power-down sequences.

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