Part Details for ZL30105QDG1 by Microsemi Corporation
Overview of ZL30105QDG1 by Microsemi Corporation
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for ZL30105QDG1
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Bristol Electronics | 532 |
|
RFQ |
Part Details for ZL30105QDG1
ZL30105QDG1 CAD Models
ZL30105QDG1 Part Data Attributes
|
|
ZL30105QDG1
Microsemi Corporation
Buy Now
Datasheet
|
Compare Parts:
ZL30105QDG1
Microsemi Corporation
Telecom Circuit, 1-Func, CMOS, PQFP64, 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | QFP | |
| Package Description | TFQFP, TQFP64,.47SQ | |
| Pin Count | 64 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| JESD-30 Code | S-PQFP-G64 | |
| JESD-609 Code | e3 | |
| Length | 10 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 64 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP64,.47SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Current-Max | 78 mA | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 10 mm |