Part Details for ZL30116GGG2 by Microsemi Corporation
Overview of ZL30116GGG2 by Microsemi Corporation
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- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for ZL30116GGG2
ZL30116GGG2 CAD Models
ZL30116GGG2 Part Data Attributes
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ZL30116GGG2
Microsemi Corporation
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Datasheet
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ZL30116GGG2
Microsemi Corporation
Telecom IC, PBGA100,
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Part Package Code | BGA | |
Pin Count | 100 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B100 | |
Number of Terminals | 100 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA100,10X10,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM |