Part Details for ZL30252LDF1 by Microsemi Corporation
Overview of ZL30252LDF1 by Microsemi Corporation
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Part Details for ZL30252LDF1
ZL30252LDF1 CAD Models
ZL30252LDF1 Part Data Attributes
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ZL30252LDF1
Microsemi Corporation
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ZL30252LDF1
Microsemi Corporation
Microprocessor Circuit, CMOS, QFN-32
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | HVQCCN, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | IT ALSO REQUIRED 3.3V SUPPLY | |
| JESD-30 Code | S-XQCC-N32 | |
| Length | 5 mm | |
| Number of Terminals | 32 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 5 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |