Part Details for ZSSC3230BI6B by Renesas Electronics Corporation
Overview of ZSSC3230BI6B by Renesas Electronics Corporation
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Healthcare
Price & Stock for ZSSC3230BI6B
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
1833-ZSSC3230BI6B-ND
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DigiKey | ZSSC3230BI6B (WAFER UNSAWN, 725, Min Qty: 21787 Lead time: 24 Weeks Container: Tray | Temporarily Out of Stock |
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$1.2526 | Buy Now |
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DISTI #
ZSSC3230BI6B
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Avnet Americas | ZSSC3230BI6B (WAFER UNSAWN, 725, WITH IN - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ZSSC3230BI6B) RoHS: Not Compliant Min Qty: 21787 Package Multiple: 21787 Lead time: 26 Weeks, 1 Days Container: Waffle Pack | 0 |
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$1.1049 / $1.2615 | Buy Now |
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DISTI #
964-ZSSC3230BI6B
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Mouser Electronics | Sensor Interface ZSSC3230BI6B (WAFER UNSAWN, 725, WITH IN RoHS: Compliant | 0 |
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$1.1700 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 21787 Package Multiple: 21787 | 0 |
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$1.0700 | Buy Now |
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DISTI #
ZSSC3230BI6B
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Avnet Americas | ZSSC3230BI6B (WAFER UNSAWN, 725, WITH IN - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ZSSC3230BI6B) RoHS: Not Compliant Min Qty: 21787 Package Multiple: 21787 Lead time: 26 Weeks, 1 Days Container: Waffle Pack | 0 |
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$1.1049 / $1.2615 | Buy Now |
Part Details for ZSSC3230BI6B
ZSSC3230BI6B CAD Models
ZSSC3230BI6B Part Data Attributes:
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ZSSC3230BI6B
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
ZSSC3230BI6B
Renesas Electronics Corporation
Analog Circuit, 1 Func, 1 Channel, CMOS
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Package Description | DIE-12 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 26 Weeks, 1 Day | |
| Analog IC - Other Type | ANALOG CIRCUIT | |
| JESD-30 Code | R-XUUC-N12 | |
| Number of Channels | 1 | |
| Number of Functions | 1 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Equivalence Code | DIE OR CHIP | |
| Package Shape | RECTANGULAR | |
| Package Style | UNCASED CHIP | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 1.68 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | NO LEAD | |
| Terminal Position | UNSPECIFIED |