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C1005X5R1H104K050BB
TDK Corporation
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$0.0301 | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0402 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 500 µm | 1 mm | 500 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C2012X7S2A105K125AB
TDK Corporation
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$0.1615 | Yes | Yes | Active | 1 µF | 100 V | 10 % | 0805 | X7S | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 22% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C1005X5R0J475K050BC
TDK Corporation
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$0.1026 | Yes | Yes | Active | 4.7 µF | 6.3 V | 10 % | 0402 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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GRM1885C1H220JA01D
Murata Manufacturing Co Ltd
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$0.0204 | Yes | Yes | Not Recommended | 22 pF | 50 V | 5 % | 0603 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | MURATA MANUFACTURING CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 | Murata Electronics | 0603 | |||
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0805B104K500CT
Walsin Technology Corporation
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$0.0237 | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 800 µm | 2 mm | 1.25 mm | WALSIN TECHNOLOGY CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | Walsin Technology Corporation | ||||
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C2012X7R1E475K125AB
TDK Corporation
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$0.1082 | Yes | Yes | Active | 4.7 µF | 25 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C1608X7R1E105K080AB
TDK Corporation
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$0.0646 | Yes | Yes | Active | 1 µF | 25 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C3225X7S2A475M200AB
TDK Corporation
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$0.7391 | Yes | Yes | Not Recommended | 4.7 µF | 100 V | 20 % | 1210 | X7S | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 22% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 2 mm | 3.2 mm | 2.5 mm | TDK CORP | , 1210 | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C3216X5R0J107M160AB
TDK Corporation
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$0.4741 | Yes | Yes | Active | 100 µF | 6.3 V | 20 % | 1206 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.6 mm | 3.2 mm | 1.6 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C3216X7R1E106K160AB
TDK Corporation
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$0.2201 | Yes | Yes | Active | 10 µF | 25 V | 10 % | 1206 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.6 mm | 3.2 mm | 1.6 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK |