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31 - 40 of 86,207,529 results
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0402X105K100CT
Walsin Technology Corporation
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$0.0085 | Yes | Yes | Active | 1 µF | 10 V | 10 % | 0402 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 500 µm | 1 mm | 500 µm | WALSIN TECHNOLOGY CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | Walsin Technology Corporation | ||||
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0603B103K500CT
Walsin Technology Corporation
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$0.0088 | Yes | Yes | Active | 10 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | WALSIN TECHNOLOGY CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | Walsin Technology Corporation | ||||
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C1608X7R1H224K080AB
TDK Corporation
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$0.0606 | Yes | Yes | Active | 220 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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GMK316BJ106KL-T
TAIYO YUDEN
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$0.1013 | Yes | Yes | Not Recommended | 10 µF | 35 V | 10 % | 1206 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | TR, EMBOSSED, 7 INCH | YES | TIN | WRAPAROUND | TAIYO YUDEN CO LTD | CHIP, LEAD FREE | compliant | EAR99 | 8532.24.00.20 | TAIYO YUDEN | 1206 | |||||||
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C1608X5R1C106M080AB
TDK Corporation
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$0.2214 | Yes | Active | 10 µF | 16 V | 20 % | 0603 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||||
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C3225X7R1C226M250AC
TDK Corporation
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$0.1940 | Yes | Yes | Active | 22 µF | 16 V | 20 % | 1210 | X7R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 2.5 mm | 3.2 mm | 2.5 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C3216X7R1C106K160AC
TDK Corporation
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$0.0852 | Yes | Yes | Active | 10 µF | 16 V | 10 % | 1206 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.6 mm | 3.2 mm | 1.6 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C2012X5R0J476M125AC
TDK Corporation
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$0.2997 | Yes | Yes | Active | 47 µF | 6.3 V | 20 % | 0805 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C3225X7S1H106M250AB
TDK Corporation
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$0.4779 | Yes | Yes | Not Recommended | 10 µF | 50 V | 20 % | 1210 | X7S | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 22% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 2.5 mm | 3.2 mm | 2.5 mm | TDK CORP | , 1210 | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C3225X5R0J107M250AC
TDK Corporation
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$0.6164 | Yes | Yes | Obsolete | 100 µF | 6.3 V | 20 % | 1210 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 2.5 mm | 3.2 mm | 2.5 mm | TDK CORP | , 1210 | compliant | EAR99 | 8532.24.00.20 | TDK |