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C2012X7S2A105K125AB
TDK Corporation
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$0.1623 | Yes | Yes | Active | 1 µF | 100 V | 10 % | 0805 | X7S | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 22% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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C1608X5R1C475K080AC
TDK Corporation
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$0.0767 | Yes | Yes | Active | 4.7 µF | 16 V | 10 % | 0603 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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C1608X5R1A106M080AC
TDK Corporation
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$0.1606 | Yes | Yes | Not Recommended | 10 µF | 10 V | 20 % | 0603 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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C3216X7R1E106K160AB
TDK Corporation
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$0.2212 | Yes | Yes | Active | 10 µF | 25 V | 10 % | 1206 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.6 mm | 3.2 mm | 1.6 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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C3216X5R0J107M160AB
TDK Corporation
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$0.4755 | Yes | Yes | Active | 100 µF | 6.3 V | 20 % | 1206 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.6 mm | 3.2 mm | 1.6 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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C2012X5R1V106K085AC
TDK Corporation
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$0.3190 | Yes | Yes | Not Recommended | 10 µF | 35 V | 10 % | 0805 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 850 µm | 2 mm | 1.25 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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C3225X7R2A225K230AB
TDK Corporation
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$0.3137 | Yes | Yes | Active | 2.2 µF | 100 V | 10 % | 1210 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 2.3 mm | 3.2 mm | 2.5 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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C3216X5R1E336M160AC
TDK Corporation
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$0.5172 | Yes | Yes | Active | 33 µF | 25 V | 20 % | 1206 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.6 mm | 3.2 mm | 1.6 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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C4532X7R1E226M250KC
TDK Corporation
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$0.4913 | Yes | Yes | Active | 22 µF | 25 V | 20 % | 1812 | X7R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 2.5 mm | 4.5 mm | 3.2 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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C2012X5R1E226M125AC
TDK Corporation
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$0.7727 | Yes | Yes | Active | 22 µF | 25 V | 20 % | 0805 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK |