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C0805C104K5RACTU
KEMET Corporation
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$0.0379 | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PUNCHED PAPER, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 780 µm | 2 mm | 1.25 mm | KEMET ELECTRONICS CORP | 0805 | CHIP | compliant | EAR99 | 8532.24.00.20 | KEMET | |||
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GRM188R71C104KA01D
Murata Manufacturing Co Ltd
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$0.0128 | Yes | Yes | Obsolete | 100 nF | 16 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | MURATA MANUFACTURING CO LTD | 0603 | CHIP | compliant | EAR99 | 8532.24.00.20 | Murata Electronics | |||
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C1608X7R1H104K080AA
TDK Corporation
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$0.0181 | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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GRM21BR71H104KA01L
Murata Manufacturing Co Ltd
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$0.0210 | Yes | Yes | Obsolete | 100 nF | 50 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, EMBOSSED, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | MURATA MANUFACTURING CO LTD | 0805 | CHIP | compliant | EAR99 | 8532.24.00.20 | Murata Electronics | |||
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C1608X5R1A226M080AC
TDK Corporation
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$0.1445 | Yes | Yes | Active | 22 µF | 10 V | 20 % | 0603 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C2012X5R1V226M125AC
TDK Corporation
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$0.3940 | Yes | Active | 22 µF | 35 V | 20 % | 0805 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||||
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C1608X5R1A106K080AC
TDK Corporation
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$0.1363 | Yes | Yes | Active | 10 µF | 10 V | 10 % | 0603 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C3216X5R1C476M160AB
TDK Corporation
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$0.4790 | Yes | Yes | Active | 47 µF | 16 V | 20 % | 1206 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.6 mm | 3.2 mm | 1.6 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C1005X5R1A475K050BC
TDK Corporation
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$0.1313 | Yes | Yes | Active | 4.7 µF | 10 V | 10 % | 0402 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C3225X7S2A475K200AB
TDK Corporation
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$0.7018 | Yes | Yes | Active | 4.7 µF | 100 V | 10 % | 1210 | X7S | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 22% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 2 mm | 3.2 mm | 2.5 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK |