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1 - 10 of 86,213,492 results
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CL10B104KB8NNNC
Samsung Electro-Mechanics
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$0.0167 | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, CARDBOARD PAPER, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 900 µm | 1.6 mm | 800 µm | SAMSUNG ELECTRO-MECHANICS | 0603 | CHIP | compliant | EAR99 | 8532.24.00.20 | ||||
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C0805C104K5RACTU
KEMET Corporation
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$0.0404 | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PUNCHED PAPER, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 780 µm | 2 mm | 1.25 mm | KEMET ELECTRONICS CORP | 0805 | CHIP | compliant | EAR99 | 8532.24.00.20 | KEMET | |||
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C1005X7R1H104K050BB
TDK Corporation
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$0.0274 | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0402 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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CL10B104KB8NNNC
Samsung Semiconductor
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Check for Price | Yes | Unknown | SAMSUNG SEMICONDUCTOR INC | compliant | SAMSUNG | ||||||||||||||||||||||||||||||||
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GRM155R71E103KA01D
Murata Manufacturing Co Ltd
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$0.0110 | Yes | Yes | Active | 10 nF | 25 V | 10 % | 0402 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | MURATA MANUFACTURING CO LTD | 0402 | CHIP | compliant | EAR99 | 8532.24.00.20 | Murata Electronics | |||
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C3216X5R1V226M160AC
TDK Corporation
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$0.4417 | Yes | Yes | Active | 22 µF | 35 V | 20 % | 1206 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.6 mm | 3.2 mm | 1.6 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C1608X7R1H104K080AA
TDK Corporation
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$0.0181 | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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GRM188R71H103KA01D
Murata Manufacturing Co Ltd
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Check for Price | Yes | Yes | Obsolete | 10 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | MURATA MANUFACTURING CO LTD | 0603 | CHIP | compliant | EAR99 | 8532.24.00.20 | Murata Electronics | |||
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C2012X5R1V226M125AC
TDK Corporation
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$0.4430 | Yes | Active | 22 µF | 35 V | 20 % | 0805 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||||
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C1608X5R1A226M080AC
TDK Corporation
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$0.1455 | Yes | Yes | Active | 22 µF | 10 V | 20 % | 0603 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK |