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TMK105B7103KV-F
TAIYO YUDEN
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$0.0013 | Yes | Yes | Not Recommended | 10 nF | 25 V | 10 % | 0402 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | TIN | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | 0402 | CHIP | compliant | EAR99 | 8532.24.00.20 | TAIYO YUDEN | |||
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UMK105CG150JV-F
TAIYO YUDEN
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$0.0020 | Yes | Yes | Not Recommended | 15 pF | 50 V | 5 % | 0402 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | 0402 | CHIP | compliant | EAR99 | 8532.24.00.20 | TAIYO YUDEN | |||
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C0603C0G1E020B
TDK Corporation
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$0.0020 | Active | unknown | |||||||||||||||||||||||||||||||||||
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UMK105CG180JV-F
TAIYO YUDEN
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$0.0020 | Yes | Yes | Not Recommended | 18 pF | 50 V | 5 % | 0402 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | 0402 | CHIP | compliant | EAR99 | 8532.24.00.20 | TAIYO YUDEN | |||
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CL03A103KQ3NNNC
Samsung Electro-Mechanics
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$0.0020 | Yes | Yes | Obsolete | 10 nF | 6.3 V | 10 % | 0201 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, CARDBOARD, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 300 µm | 600 µm | 300 µm | SAMSUNG ELECTRO-MECHANICS | 0201 | CHIP | compliant | EAR99 | 8532.24.00.20 | SAMSUNG | |||
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0805F474Z500CT
Walsin Technology Corporation
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$0.0024 | Yes | Yes | Obsolete | 470 nF | 50 V | 80 % | 0805 | Y5V | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | -80/+30% ppm/°C | e3 | 85 °C | -25 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 2 mm | 1.25 mm | WALSIN TECHNOLOGY CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | Walsin Technology Corporation | ||||
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CL21B222KCANNNC
Samsung Electro-Mechanics
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$0.0024 | Yes | Yes | Obsolete | 2.2 nF | 100 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, CARDBOARD PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 650 µm | 2 mm | 1.25 mm | SAMSUNG ELECTRO-MECHANICS | 0805 | CHIP | compliant | EAR99 | 8532.24.00.20 | SAMSUNG | |||
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UMK105B7102KV-F
TAIYO YUDEN
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$0.0025 | Yes | Yes | Not Recommended | 1 nF | 50 V | 10 % | 0402 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | 0402 | CHIP | compliant | EAR99 | 8532.24.00.20 | TAIYO YUDEN | |||
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VJ0805Y223KXBBC31
Vishay Intertechnologies
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$0.0034 | Yes | No | Not Recommended | 22 nF | 100 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PLASTIC, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.45 mm | 2 mm | 1.25 mm | VISHAY INTERTECHNOLOGY INC | CHIP | compliant | EAR99 | 8532.24.00.20 | Vishay | |||
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160R15W104KV4T
Johanson Dielectrics Inc
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$0.0035 | Yes | Yes | Obsolete | 100 nF | 16 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.27 mm | 2.29 mm | 1.52 mm | JOHANSON DIELECTRICS INC | CHIP | compliant | EAR99 | 8532.24.00.20 |