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41 - 50 of 34,913 results
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WM8726GID/V
Cirrus Logic
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Check for Price | Obsolete | 5 V | 24 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | CMOS | INDUSTRIAL | R-PDSO-G14 | 85 °C | -40 °C | 14 | PLASTIC/EPOXY | SOP | SOP14,.23 | RECTANGULAR | SMALL OUTLINE | GULL WING | 1.27 mm | DUAL | 3.9 mm | 1.75 mm | 8.65 mm | CIRRUS LOGIC INC | SOP, SOP14,.23 | compliant | 8542.39.00.01 | ||||||||||||||||||||||
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MC144110P
Motorola Semiconductor Products
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Check for Price | No | Obsolete | 5 V | 6 | NO | D/A CONVERTER | BINARY | SERIAL | 1 | CMOS | OTHER | R-PDIP-T18 | Not Qualified | e0 | 85 °C | 18 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 4.57 mm | 22.73 mm | MOTOROLA INC | DIP, | unknown | 8542.39.00.01 | ||||||||||||||||||||
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DAC7541AKPG4
Texas Instruments
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Check for Price | Yes | Yes | Obsolete | 15 V | 0.0244 % | 12 | NO | D/A CONVERTER | BINARY | PARALLEL, WORD | 1 | 600 ns | 2 mA | CMOS | COMMERCIAL | R-PDIP-T18 | Not Qualified | e4 | 70 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NICKEL PALLADIUM GOLD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 5.08 mm | 22.48 mm | TEXAS INSTRUMENTS INC | DIP, DIP18,.3 | compliant | 8542.39.00.01 | DIP | 18 | Texas Instruments | ||||||||||||
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AD5314BRM
Analog Devices Inc
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Check for Price | No | No | Obsolete | 3 V | 5.499 V | 1 mV | 0.2441 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 9 µs | 7 µs | 900 µA | CMOS | INDUSTRIAL | S-PDSO-G10 | Not Qualified | e0 | 1 | 105 °C | -40 °C | 240 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | ANALOG DEVICES INC | TSSOP, TSSOP10,.19,20 | not_compliant | 8542.39.00.01 | TSSOP | 10 | Analog Devices | RM-10 | |||||
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AD5629RACPZ-2-RL7
Analog Devices Inc
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$12.4988 | No | Yes | Active | 3 V | 5.5 V | 0.0977 % | 12 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 7 µs | 2.5 µs | 2.5 mA | CMOS | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 3 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 4 mm | 800 µm | 4 mm | ANALOG DEVICES INC | LFCSP-16 | compliant | 8542.39.00.01 | QFN | 16 | Analog Devices | CP-16-17 | EAR99 | ||||
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MAX530BEAG+
Maxim Integrated Products
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$7.4111 | Yes | Yes | Obsolete | 5 V | 5.1 V | -5.1 V | 0.0366 % | 12 | YES | D/A CONVERTER | BINARY, OFFSET BINARY | PARALLEL, WORD | -5 V | 1 | 25 µs | 400 µA | INDUSTRIAL | R-PDSO-G24 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | SSOP | SSOP24(UNSPEC) | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 5.29 mm | 1.99 mm | 8.2 mm | MAXIM INTEGRATED PRODUCTS INC | SSOP, SSOP24(UNSPEC) | compliant | 8542.39.00.01 | SSOP | 24 | EAR99 | ||||||
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AD5764ASUZ
Analog Devices Inc
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$40.3573 | No | Yes | Active | 5 V | 10.5263 V | -10.5263 V | 0.0061 % | 16 | YES | D/A CONVERTER | OFFSET BINARY, 2'S COMPLEMENT BINARY | SERIAL | 1 | 10 µs | 10 µs | CMOS | INDUSTRIAL | S-PQFP-G32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | TQFP | TQFP32,.35SQ,32 | SQUARE | FLATPACK, THIN PROFILE | Matte Tin (Sn) - annealed | GULL WING | 800 µm | QUAD | 7 mm | 1.2 mm | 7 mm | ANALOG DEVICES INC | TQFP-32 | compliant | 8542.39.00.01 | QFP | 32 | Analog Devices | SU-32-2 | EAR99 | ||||
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TDA8702TD-T
NXP Semiconductors
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Check for Price | Obsolete | 5 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | PARALLEL, 8 BITS | 1 | 6.5 ns | 32 mA | COMMERCIAL | R-PDSO-G16 | Not Qualified | 70 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | GULL WING | 1.27 mm | DUAL | 7.5 mm | 2.65 mm | 10.3 mm | NXP SEMICONDUCTORS | SOP, | unknown | 8542.39.00.01 | |||||||||||||||||||||
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LTC1662CMS8#PBF
Linear Technology
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$2.2117 | Yes | Transferred | 3 V | 5.494 V | 0.3906 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 750 µs | 5.5 µA | CMOS | COMMERCIAL | S-PDSO-G8 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | LINEAR TECHNOLOGY CORP | LEAD FREE, PLASTIC, MSOP-8 | compliant | 8542.39.00.01 | MSOP | 8 | MS8 | |||||||||
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MAX5898EGK-D
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 1.8 V | 1.1 V | -500 mV | 16 | YES | D/A CONVERTER | OFFSET BINARY, 2'S COMPLEMENT BINARY | PARALLEL, WORD | 1 | 11 ns | CMOS | INDUSTRIAL | S-XQCC-N68 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 245 | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | 10 X 10 MM, 0.85 MM HEIGHT, MO-220, QFN-68 | not_compliant | 8542.39.00.01 | QFN | 68 | EAR99 |