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Parametric results for: HI5721BIB-T under Digital to Analog Converters

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CAT-DACIQ12B122M-28
 Maxim Integrated Products 		Check for Price Transferred 900 mV 0.02441 % 12 D/A CONVERTER BINARY PARALLEL, WORD 2 CMOS 125 °C -40 °C MAXIM INTEGRATED PRODUCTS INC compliant 8542.39.00.01
DAC39J82IAAV
 Texas Instruments 		$90.3158 Yes Yes Active 900 mV 600 mV -500 mV 16 2.8 GHz YES D/A CONVERTER OFFSET BINARY, 2'S COMPLEMENT BINARY SERIAL 1 10 ns CMOS INDUSTRIAL S-PBGA-B144 e1 3 85 °C -40 °C 260 30 144 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 800 µm BOTTOM 10 mm 1.94 mm 10 mm TEXAS INSTRUMENTS INC compliant 8542.39.00.01 DAC39J82IAAV HBGA, 3A001.A.5.B.2.B Texas Instruments
DAC38J84IAAV
 Texas Instruments 		$93.7129 Yes Yes Active 900 mV 600 mV -500 mV 16 2.5 GHz YES D/A CONVERTER OFFSET BINARY, 2'S COMPLEMENT BINARY PARALLEL, WORD 1 10 ns CMOS INDUSTRIAL S-PBGA-B144 e1 3 85 °C -40 °C 260 30 144 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 800 µm BOTTOM 10 mm 1.94 mm 10 mm TEXAS INSTRUMENTS INC compliant 8542.39.00.01 DAC38J84IAAV HBGA, EAR99 Texas Instruments BGA 144
DAC37J82IAAVR
 Texas Instruments 		$42.4154 Yes Yes Active 900 mV 600 mV -500 mV 16 1.6 GHz YES D/A CONVERTER OFFSET BINARY, 2'S COMPLEMENT BINARY PARALLEL, WORD 1 10 ns CMOS INDUSTRIAL S-PBGA-B144 e1 3 85 °C -40 °C 260 30 144 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 800 µm BOTTOM 10 mm 1.94 mm 10 mm TEXAS INSTRUMENTS INC compliant 8542.39.00.01 DAC37J82IAAVR HBGA, EAR99 Texas Instruments BGA 144
DAC38J82IAAV
 Texas Instruments 		$76.7218 Yes Yes Active 900 mV 600 mV -500 mV 16 2.5 GHz YES D/A CONVERTER OFFSET BINARY, 2'S COMPLEMENT BINARY PARALLEL, WORD 1 10 ns CMOS INDUSTRIAL S-PBGA-B144 e1 3 85 °C -40 °C 260 30 144 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 800 µm BOTTOM 10 mm 1.94 mm 10 mm TEXAS INSTRUMENTS INC compliant 8542.39.00.01 DAC38J82IAAV HBGA, EAR99 Texas Instruments BGA 144
DAC37J84IAAV
 Texas Instruments 		$95.4222 Yes Yes Active 900 mV 600 mV -500 mV 16 1.6 GHz YES D/A CONVERTER OFFSET BINARY, 2'S COMPLEMENT BINARY PARALLEL, WORD 1 10 ns CMOS INDUSTRIAL S-PBGA-B144 e1 3 85 °C -40 °C 260 30 144 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 800 µm BOTTOM 10 mm 1.94 mm 10 mm TEXAS INSTRUMENTS INC compliant 8542.39.00.01 DAC37J84IAAV HBGA, EAR99 Texas Instruments BGA 144
CAT-DACIQ12B80M-28
 Maxim Integrated Products 		Check for Price Transferred 900 mV 0.02441 % 12 D/A CONVERTER BINARY PARALLEL, WORD 2 CMOS 125 °C -40 °C MAXIM INTEGRATED PRODUCTS INC compliant 8542.39.00.01
DAC39J82IAAVR
 Texas Instruments 		$94.2700 Yes Yes Active 900 mV 600 mV -500 mV 16 2.8 GHz YES D/A CONVERTER OFFSET BINARY, 2'S COMPLEMENT BINARY SERIAL 1 10 ns CMOS INDUSTRIAL S-PBGA-B144 e1 3 85 °C -40 °C 260 30 144 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 800 µm BOTTOM 10 mm 1.94 mm 10 mm TEXAS INSTRUMENTS INC compliant 8542.39.00.01 DAC39J82IAAVR HBGA, 3A001.A.5.B.2.B
DAC38J82IAAVR
 Texas Instruments 		$71.5982 Yes Yes Active 900 mV 600 mV -500 mV 16 2.5 GHz YES D/A CONVERTER OFFSET BINARY, 2'S COMPLEMENT BINARY PARALLEL, WORD 1 10 ns CMOS INDUSTRIAL S-PBGA-B144 e1 3 85 °C -40 °C 260 30 144 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 800 µm BOTTOM 10 mm 1.94 mm 10 mm TEXAS INSTRUMENTS INC compliant 8542.39.00.01 DAC38J82IAAVR HBGA, EAR99 Texas Instruments BGA 144
DAC38J84IAAVR
 Texas Instruments 		$97.9000 Yes Yes Active 900 mV 600 mV -500 mV 16 2.5 GHz YES D/A CONVERTER OFFSET BINARY, 2'S COMPLEMENT BINARY PARALLEL, WORD 1 10 ns CMOS INDUSTRIAL S-PBGA-B144 e1 3 85 °C -40 °C 260 30 144 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 800 µm BOTTOM 10 mm 1.94 mm 10 mm TEXAS INSTRUMENTS INC compliant 8542.39.00.01 DAC38J84IAAVR HBGA, EAR99 Texas Instruments BGA 144
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