Parametric results for: Other Interface ICs
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GTL2010PW,112
NXP Semiconductors
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$0.4250 | Yes | Obsolete | 2.5 V | 3.3 V | INTERFACE CIRCUIT | 10 | 2.64 V | 2.36 V | 3.6 V | 3 V | YES | INDUSTRIAL | R-PDSO-G24 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 7.8 mm | 1.1 mm | 4.4 mm | NXP SEMICONDUCTORS | TSSOP2 | 4.40 MM, PLASTIC, MO-153, SOT-355-1, TSSOP-24 | 24 | SOT355-1 | compliant | 8542.39.00.01 | |||||||
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GTL2010PW-T
NXP Semiconductors
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Check for Price | Yes | Obsolete | 2.5 V | 3.3 V | INTERFACE CIRCUIT | 10 | 2.64 V | 2.36 V | 3.6 V | 3 V | YES | INDUSTRIAL | R-PDSO-G24 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 7.8 mm | 1.1 mm | 4.4 mm | NXP SEMICONDUCTORS | TSSOP | 4.40 MM, PLASTIC, MO-153, SOT-355-1, TSSOP-24 | 24 | unknown | 8542.39.00.01 | ||||||||
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GTL2010PW,118
NXP Semiconductors
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$0.7464 | Yes | Obsolete | 2.5 V | 3.3 V | INTERFACE CIRCUIT | 10 | 2.64 V | 2.36 V | 3.6 V | 3 V | YES | INDUSTRIAL | R-PDSO-G24 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 7.8 mm | 1.1 mm | 4.4 mm | NXP SEMICONDUCTORS | TSSOP2 | 4.40 MM, PLASTIC, MO-153, SOT-355-1, TSSOP-24 | 24 | SOT355-1 | compliant | 8542.39.00.01 | NXP | ||||||
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GTL2010PW/N,118
NXP Semiconductors
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Check for Price | No | Obsolete | 2.5 V | 3.3 V | INTERFACE CIRCUIT | 10 | 2.64 V | 2.36 V | 3.6 V | 3 V | YES | INDUSTRIAL | R-PDSO-G24 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 7.8 mm | 1.1 mm | 4.4 mm | NXP SEMICONDUCTORS | TSSOP | TSSOP, | 24 | unknown | 8542.39.00.01 | ||||||||
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GTL2010PW
NXP Semiconductors
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Check for Price | Yes | Yes | Obsolete | 2.5 V | 3.3 V | INTERFACE CIRCUIT | 10 | 2.64 V | 2.36 V | 3.6 V | 3 V | YES | INDUSTRIAL | R-PDSO-G24 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 7.8 mm | 1.1 mm | 4.4 mm | NXP SEMICONDUCTORS | TSSOP | 4.40 MM, PLASTIC, MO-153, SOT-355-1, TSSOP-24 | 24 | unknown | 8542.39.00.01 | NXP | ||||||
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GTL2010BS
NXP Semiconductors
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Check for Price | Yes | Yes | Obsolete | 2.5 V | 3.3 V | INTERFACE CIRCUIT | 10 | 2.64 V | 2.36 V | 3.6 V | 3 V | YES | INDUSTRIAL | S-XDSO-N24 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 4 mm | 1 mm | 4 mm | NXP SEMICONDUCTORS | QFN | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT-616-1, HVQFN-24 | 24 | compliant | 8542.39.00.01 | NXP | ||||||
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GTL2010BS,118
NXP Semiconductors
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Check for Price | Yes | Obsolete | 2.5 V | 3.3 V | INTERFACE CIRCUIT | 10 | 2.64 V | 2.36 V | 3.6 V | 3 V | YES | INDUSTRIAL | S-XDSO-N24 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | VSON | SQUARE | SMALL OUTLINE, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 4 mm | 1 mm | 4 mm | NXP SEMICONDUCTORS | QFN | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT-616-1, HVQFN-24 | 24 | SOT616-1 | compliant | 8542.39.00.01 | NXP | ||||||
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ADG3308BCP
Analog Devices Inc
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Check for Price | No | No | Obsolete | INTERFACE CIRCUIT | 8 | 5.5 V | 1.1 V | 5.5 V | 1.65 V | YES | INDUSTRIAL | S-XQCC-N20 | Not Qualified | e0 | 85 °C | -40 °C | 20 | UNSPECIFIED | HVQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 4 mm | 900 µm | 4 mm | ANALOG DEVICES INC | QFN | 4 X 4 MM, LFCSP-20 | 20 | unknown | 8542.39.00.01 | |||||||||||
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MAX3013EBP-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | INTERFACE CIRCUIT | BICMOS | 8 | 3.6 V | 1.65 V | YES | INDUSTRIAL | R-PBGA-B20 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | VFBGA | BGA20,4X5,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN LEAD | BALL | 500 µm | BOTTOM | 2.54 mm | 670 µm | 2.03 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 5 X 4 MM, UCSP-20 | 20 | not_compliant | 8542.39.00.01 | ||||||||||
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MAX3013EGP
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | INTERFACE CIRCUIT | BICMOS | 8 | 3.6 V | 1.65 V | YES | INDUSTRIAL | S-XQCC-N20 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 20 | UNSPECIFIED | HVQCCN | LCC20,.20SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 650 µm | QUAD | 5 mm | 1 mm | 5 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 5 X 5 MM, 0.90 MM HEIGHT, MO-220, QFN-20 | 20 | not_compliant | 8542.39.00.01 | EAR99 |