Parametric results for: NC7SZ74K8X under FF/Latches

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SSTUB32865ET/G
NXP Semiconductors
Check for Price Yes Obsolete 1.8 V 1.5 ns 1 28 YES TFBGA POSITIVE EDGE OPEN-DRAIN 32865 D FLIP-FLOP CMOS 450 MHz COMPLEMENTARY 2 V 1.7 V COMMERCIAL R-PBGA-B160 Not Qualified 2 70 °C NOT SPECIFIED NOT SPECIFIED 160 PLASTIC/EPOXY BGA160,12X18,25 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH BALL 650 µm BOTTOM 1.15 mm 9 mm 13 mm NXP SEMICONDUCTORS BGA TFBGA, BGA160,12X18,25 160 SOT-802-2 unknown 8542.39.00.01
ICSSSTUB32872AHMT
Integrated Device Technology Inc
Check for Price No No Transferred 1.8 V 3 ns 1 28 YES TFBGA POSITIVE EDGE 32872 D FLIP-FLOP 410 MHz TRUE 1.9 V 1.7 V COMMERCIAL R-PBGA-B96 Not Qualified e0 70 °C 96 PLASTIC/EPOXY BGA96,6X16,25 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH TIN LEAD BALL 650 µm BOTTOM 1.2 mm 5 mm 11.5 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA96,6X16,25 96 compliant 8542.39.00.01
ICSSSTUA32S865AH-T
Integrated Device Technology Inc
Check for Price No No Obsolete 1.8 V 1.9 ns 1 28 YES TFBGA POSITIVE EDGE OPEN-DRAIN SSTU D FLIP-FLOP CMOS 410 MHz TRUE 1.9 V 1.7 V COMMERCIAL R-PBGA-B160 Not Qualified e0 70 °C 160 PLASTIC/EPOXY BGA160,12X18,25 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH TIN LEAD BALL 650 µm BOTTOM 1.2 mm 9 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA160,12X18,25 160 not_compliant 8542.39.00.01
SSTUA32S865ET/G
NXP Semiconductors
Check for Price Yes Obsolete 1.8 V 1.8 ns 1 28 YES TFBGA POSITIVE EDGE OPEN-DRAIN SSTU D FLIP-FLOP CMOS 450 MHz TRUE 2 V 1.7 V COMMERCIAL R-PBGA-B160 Not Qualified 2 70 °C NOT SPECIFIED NOT SPECIFIED 160 PLASTIC/EPOXY BGA160,12X18,25 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH BALL 650 µm BOTTOM 1.2 mm 9 mm 13 mm NXP SEMICONDUCTORS BGA TFBGA, BGA160,12X18,25 160 SOT-802-1 unknown 8542.39.00.01
ICSSSTUAF32868AHLFT
Integrated Device Technology Inc
Check for Price Yes Yes Obsolete 1.8 V 3 ns 1 28 YES LFBGA POSITIVE EDGE 32868 D FLIP-FLOP 410 MHz TRUE 1.9 V 1.7 V COMMERCIAL R-PBGA-B176 Not Qualified e1 3 70 °C 260 30 176 PLASTIC/EPOXY BGA176,8X22,25 RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 650 µm BOTTOM 1.55 mm 6 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA176,8X22,25 176 compliant 8542.39.00.01
74SSTUB32865AZJBR
Texas Instruments
$11.8122 Yes Obsolete 1.8 V 3 ns 1.1 ns 1 28 YES TFBGA 410 MHz POSITIVE EDGE OPEN-DRAIN SSTU D FLIP-FLOP TTL 410 MHz 12 mA TRUE 1.9 V 1.7 V INDUSTRIAL R-PBGA-B160 Not Qualified e1 3 85 °C -40 °C 260 30 160 PLASTIC/EPOXY BGA160,12X18,25 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH TR TIN SILVER COPPER BALL 650 µm BOTTOM 1.2 mm 9 mm 13 mm TEXAS INSTRUMENTS INC BGA PLASTIC, TFBGA-160 160 compliant 8542.39.00.01 Texas Instruments
SSTUG32865ET/G,518
NXP Semiconductors
Check for Price Yes Obsolete 1.8 V 1.4 ns 1 28 YES TFBGA POSITIVE EDGE OPEN-DRAIN SSTU D FLIP-FLOP 550 MHz TRUE 2 V 1.7 V COMMERCIAL R-PBGA-B160 Not Qualified 2 70 °C NOT SPECIFIED NOT SPECIFIED 160 PLASTIC/EPOXY RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH BALL 650 µm BOTTOM 1.15 mm 9 mm 13 mm NXP SEMICONDUCTORS BGA TFBGA, 160 SOT802-2 unknown 8542.39.00.01
SSTUM32865ET/G,518
NXP Semiconductors
Check for Price Yes Obsolete 1.8 V 1.4 ns 1 28 YES TFBGA POSITIVE EDGE OPEN-DRAIN SSTU D FLIP-FLOP 450 MHz TRUE 2 V 1.7 V COMMERCIAL R-PBGA-B160 Not Qualified 2 70 °C NOT SPECIFIED NOT SPECIFIED 160 PLASTIC/EPOXY RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH BALL 650 µm BOTTOM 1.15 mm 9 mm 13 mm NXP SEMICONDUCTORS BGA TFBGA, 160 SOT802-2 unknown 8542.39.00.01
SSTUB32872AHMLFT
Integrated Device Technology Inc
Check for Price Yes Yes Obsolete 1.8 V 3 ns 1 28 YES TFBGA POSITIVE EDGE 32872 D FLIP-FLOP 410 MHz TRUE 1.9 V 1.7 V COMMERCIAL R-PBGA-B96 Not Qualified e1 3 70 °C 260 30 96 PLASTIC/EPOXY BGA96,6X16,25 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH TIN SILVER COPPER BALL 650 µm BOTTOM 1.2 mm 5 mm 11.5 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA TFBGA, BGA96,6X16,25 96 AFG96 compliant 8542.39.00.01
SSTUG32868ET/S,518
NXP Semiconductors
Check for Price Obsolete 1.8 V 1.5 ns 1 28 YES TFBGA POSITIVE EDGE OPEN-DRAIN 32868 D FLIP-FLOP CMOS 450 MHz COMPLEMENTARY 2 V 1.7 V OTHER R-PBGA-B176 Not Qualified 2 85 °C NOT SPECIFIED NOT SPECIFIED 176 PLASTIC/EPOXY RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH BALL 650 µm BOTTOM 1.15 mm 6 mm 15 mm NXP SEMICONDUCTORS BGA 6 X 15 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, MO-246, SOT932-1, TFBGA-176 176 SOT932-1 unknown 8542.39.00.01