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Manufacturer Part Number: mt47h64m16nf25e
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package
MT47H64M16NF-25E:M
 Micron Technology Inc 		$3.9371 Buy Yes Yes Active 1.0737 Gbit 16 64MX16 1.8 V 400 ps 400 MHz 8192 MULTI BANK PAGE BURST DDR2 DRAM COMMON 4,8 1 1 64000000 67.1089 M SYNCHRONOUS 3-STATE YES 4,8 10 mA 260 µA 1.9 V 1.7 V CMOS OTHER R-PBGA-B84 Not Qualified e1 85 °C 260 30 84 PLASTIC/EPOXY TFBGA BGA84,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 12.5 mm 8 mm BGA FBGA-84 84 Not Compliant EAR99 8542.32.00.32
MT47H64M16NF-25EAAT:M
 Micron Technology Inc 		Check for Price Buy Yes Active 1.0737 Gbit 16 64MX16 1.8 V 400 ps 400 MHz 8192 MULTI BANK PAGE BURST DDR2 DRAM AUTO/SELF REFRESH COMMON 4,8 1 1 64000000 67.1089 M SYNCHRONOUS 3-STATE YES 4,8 10 mA 260 µA 1.9 V 1.7 V CMOS R-PBGA-B84 e1 105 °C -40 °C 260 AEC-Q100 30 84 PLASTIC/EPOXY TFBGA BGA84,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 800 µm BOTTOM 1.2 mm 12.5 mm 8 mm FBGA-84 Compliant EAR99 8542.32.00.32
MT47H64M16NF-25EXIT:M
 Micron Technology Inc 		Check for Price Buy Yes Obsolete 1.0737 Gbit 16 64MX16 1.8 V 400 ps MULTI BANK PAGE BURST DDR2 DRAM AUTO/SELF REFRESH 1 1 64000000 67.1089 M SYNCHRONOUS YES 1.9 V 1.7 V CMOS INDUSTRIAL R-PBGA-B84 e1 85 °C -40 °C 260 30 84 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.2 mm 12.5 mm 8 mm 8 X 12.50 MM, ROHS COMPLIANT, FBGA-84 Compliant EAR99 8542.32.00.32
MT47H64M16NF-25EIT:MT
 Micron Technology Inc 		Check for Price Buy Yes Active 1.0737 Gbit 16 64MX16 1.8 V 400 ps 400 MHz 8192 MULTI BANK PAGE BURST DDR2 DRAM AUTO/SELF REFRESH COMMON 4,8 1 1 64000000 67.1089 M SYNCHRONOUS 3-STATE YES 4,8 38 mA 260 µA 1.9 V 1.7 V CMOS INDUSTRIAL R-PBGA-B84 e1 95 °C -40 °C 260 AEC-Q100 30 84 PLASTIC/EPOXY TFBGA BGA84,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 800 µm BOTTOM 1.2 mm 12.5 mm 8 mm TFBGA, BGA84,9X15,32 Compliant EAR99 8542.32.00.32
MT47H64M16NF-25E:MTR
 Micron Technology Inc 		Check for Price Buy Yes Active 1.0737 Gbit 16 64MX16 1.8 V MULTI BANK PAGE BURST DDR2 DRAM SELF REFRESH 1 1 64000000 67.1089 M SYNCHRONOUS YES 1.9 V 1.7 V CMOS OTHER R-PBGA-B84 e1 85 °C 260 30 84 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL BOTTOM BGA, Not Compliant EAR99 8542.32.00.32
MT47H64M16NF-25EAIT:M
 Micron Technology Inc 		Check for Price Buy Yes Active 1.0737 Gbit 16 64MX16 1.8 V 400 ps 400 MHz 8192 MULTI BANK PAGE BURST DDR2 DRAM AUTO/SELF REFRESH COMMON 4,8 1 1 64000000 67.1089 M SYNCHRONOUS 3-STATE YES 4,8 10 mA 210 µA 1.9 V 1.7 V CMOS R-PBGA-B84 95 °C -40 °C 260 AEC-Q100 30 84 PLASTIC/EPOXY TFBGA BGA84,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 12.5 mm 8 mm FBGA-84 Compliant EAR99 8542.32.00.32
MT47H64M16NF-25EAAT:MTR
 Micron Technology Inc 		Check for Price Buy Yes Active 1.0737 Gbit 16 64MX16 1.8 V 400 ps 400 MHz 8192 MULTI BANK PAGE BURST DDR2 DRAM AUTO/SELF REFRESH COMMON 4,8 1 1 64000000 67.1089 M SYNCHRONOUS YES 4,8 10 mA 260 µA 1.9 V 1.7 V CMOS R-PBGA-B84 e1 105 °C -40 °C 260 AEC-Q100 30 84 PLASTIC/EPOXY TFBGA BGA84,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 800 µm BOTTOM 1.2 mm 12.5 mm 8 mm TFBGA, BGA84,9X15,32 Compliant EAR99 8542.32.00.32
package
MT47H64M16NF-25EIT:M
 Micron Technology Inc 		Check for Price Buy Yes Yes Active 1.0737 Gbit 16 64MX16 1.8 V 400 ps 400 MHz 8192 MULTI BANK PAGE BURST DDR2 DRAM COMMON 4,8 1 1 64000000 67.1089 M SYNCHRONOUS 3-STATE YES 4,8 10 mA 260 µA 1.9 V 1.7 V CMOS R-PBGA-B84 Not Qualified e1 95 °C -40 °C 260 30 84 PLASTIC/EPOXY TFBGA BGA84,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 12.5 mm 8 mm BGA FBGA-84 84 Compliant EAR99 8542.32.00.32
MT47H64M16NF-25EIT:MTR
 Micron Technology Inc 		Check for Price Buy Yes Active 1.0737 Gbit 16 64MX16 1.8 V 400 ps 400 MHz 8192 MULTI BANK PAGE BURST DDR2 DRAM AUTO/SELF REFRESH COMMON 4,8 1 1 64000000 67.1089 M SYNCHRONOUS YES 4,8 10 mA 260 µA 1.9 V 1.7 V CMOS R-PBGA-B84 e1 95 °C -40 °C 260 30 84 PLASTIC/EPOXY TFBGA BGA84,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 800 µm BOTTOM 1.2 mm 12.5 mm 8 mm TFBGA, BGA84,9X15,32 Compliant EAR99 8542.32.00.32