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Manufacturer Part Number: mt53d512m32d2ds053
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MT53D512M32D2DS-053AWT:C
Micron Technology Inc
Check for Price Buy Yes Active 17.1799 Gbit 32 512MX32 1.1 V 1.866 GHz SINGLE BANK PAGE BURST LPDDR4 DRAM SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX COMMON 16,32 1 1 512000000 536.8709 M SYNCHRONOUS 3-STATE YES 16,32 2 µA 330 µA 1.17 V 1.06 V CMOS R-PBGA-B200 e1 85 °C -25 °C 260 30 200 PLASTIC/EPOXY VFBGA BGA200,12X20,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) BALL 800 µm BOTTOM 800 µm 14.5 mm 10 mm MICRON TECHNOLOGY INC VFBGA, BGA200,12X20,32/25 Compliant EAR99 8542.32.00.36
MT53D512M32D2DS-053AWT:D
Micron Technology Inc
Check for Price Buy Yes Active 17.1799 Gbit 32 512MX32 1.1 V 1.866 GHz SINGLE BANK PAGE BURST LPDDR4 DRAM SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX COMMON 16,32 1 1 512000000 536.8709 M SYNCHRONOUS 3-STATE YES 16,32 2 µA 330 µA 1.17 V 1.06 V CMOS R-PBGA-B200 e1 85 °C -25 °C 260 30 200 PLASTIC/EPOXY VFBGA BGA200,12X20,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) BALL 800 µm BOTTOM 800 µm 14.5 mm 10 mm MICRON TECHNOLOGY INC VFBGA, BGA200,12X20,32/25 Compliant EAR99 8542.32.00.36
MT53D512M32D2DS-053WT:C
Micron Technology Inc
Check for Price Buy Yes Active 17.1799 Gbit 32 512MX32 1.1 V 1.866 GHz SINGLE BANK PAGE BURST LPDDR4 DRAM SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX COMMON 16,32 1 1 512000000 536.8709 M SYNCHRONOUS 3-STATE YES 16,32 2 µA 330 µA 1.17 V 1.06 V CMOS R-PBGA-B200 e1 85 °C -25 °C 260 30 200 PLASTIC/EPOXY VFBGA BGA200,12X20,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) BALL 800 µm BOTTOM 800 µm 14.5 mm 10 mm MICRON TECHNOLOGY INC VFBGA, BGA200,12X20,32/25 Compliant EAR99 8542.32.00.36
MT53D512M32D2DS-053WT:B
Micron Technology Inc
Check for Price Buy Yes Active 17.1799 Gbit 32 512MX32 1.1 V 1.866 GHz SINGLE BANK PAGE BURST LPDDR4 DRAM SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX COMMON 16,32 1 1 512000000 536.8709 M SYNCHRONOUS 3-STATE YES 16,32 2 µA 330 µA 1.17 V 1.06 V CMOS R-PBGA-B200 e1 85 °C -25 °C 260 30 200 PLASTIC/EPOXY VFBGA BGA200,12X20,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) BALL 800 µm BOTTOM 800 µm 14.5 mm 10 mm MICRON TECHNOLOGY INC VFBGA, BGA200,12X20,32/25 Compliant EAR99 8542.32.00.36
MT53D512M32D2DS-053WT:A
Micron Technology Inc
Check for Price Buy Yes Active 17.1799 Gbit 32 512MX32 1.1 V 1.866 GHz SINGLE BANK PAGE BURST LPDDR4 DRAM SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX COMMON 16,32 1 1 512000000 536.8709 M SYNCHRONOUS 3-STATE YES 16,32 2 µA 330 µA 1.17 V 1.06 V CMOS R-PBGA-B200 e1 85 °C -25 °C 260 30 200 PLASTIC/EPOXY VFBGA BGA200,12X20,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) BALL 800 µm BOTTOM 800 µm 14.5 mm 10 mm MICRON TECHNOLOGY INC VFBGA, BGA200,12X20,32/25 Compliant EAR99 8542.32.00.36
MT53D512M32D2DS-053AUT:D
Micron Technology Inc
Check for Price Buy Yes Obsolete 17.1799 Gbit 32 512MX32 1.1 V 1.866 GHz LPDDR4 DRAM SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX COMMON 1 1 512000000 536.8709 M SYNCHRONOUS 3-STATE YES 16,32 2 µA 330 µA 1.17 V 1.06 V CMOS AUTOMOTIVE R-PBGA-B200 125 °C -40 °C AEC-Q100 200 PLASTIC/EPOXY VFBGA BGA200,12X20,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 800 µm 14.5 mm 10 mm MICRON TECHNOLOGY INC WFBGA-200 Compliant EAR99 8542.32.00.36
MT53D512M32D2DS-053AWT:B
Micron Technology Inc
Check for Price Buy Yes Active 17.1799 Gbit 32 512MX32 1.1 V 1.866 GHz SINGLE BANK PAGE BURST LPDDR4 DRAM SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX COMMON 16,32 1 1 512000000 536.8709 M SYNCHRONOUS 3-STATE YES 16,32 2 µA 330 µA 1.17 V 1.06 V CMOS R-PBGA-B200 e1 85 °C -25 °C 260 30 200 PLASTIC/EPOXY VFBGA BGA200,12X20,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) BALL 800 µm BOTTOM 800 µm 14.5 mm 10 mm MICRON TECHNOLOGY INC VFBGA, BGA200,12X20,32/25 Compliant EAR99 8542.32.00.36
MT53D512M32D2DS-053AIT:D
Micron Technology Inc
Check for Price Buy Yes Obsolete 17.1799 Gbit 32 512MX32 1.1 V 1.866 GHz MULTI BANK PAGE BURST LPDDR4 DRAM SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX COMMON 16,32 1 1 512000000 536.8709 M SYNCHRONOUS 3-STATE YES 16,32 2 µA 330 µA 1.17 V 1.06 V CMOS R-PBGA-B200 95 °C -40 °C AEC-Q100 200 PLASTIC/EPOXY VFBGA BGA200,12X22,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 800 µm 14.5 mm 10 mm MICRON TECHNOLOGY INC WFBGA-200 Compliant EAR99 8542.32.00.36
MT53D512M32D2DS-053WT:D
Micron Technology Inc
Check for Price Buy Yes Obsolete 17.1799 Gbit 32 512MX32 1.1 V 1.866 GHz SINGLE BANK PAGE BURST LPDDR4 DRAM SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX COMMON 16,32 1 1 512000000 536.8709 M SYNCHRONOUS 3-STATE YES 16,32 2 µA 330 µA 1.17 V 1.06 V CMOS R-PBGA-B200 85 °C -25 °C 200 PLASTIC/EPOXY VFBGA BGA200,12X20,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 800 µm 14.5 mm 10 mm MICRON TECHNOLOGY INC WFBGA-200 Compliant EAR99 8542.32.00.36 Micron
MT53D512M32D2DS-053AWT:A
Micron Technology Inc
Check for Price Buy Yes Active 17.1799 Gbit 32 512MX32 1.1 V 1.866 GHz SINGLE BANK PAGE BURST LPDDR4 DRAM SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX COMMON 16,32 1 1 512000000 536.8709 M SYNCHRONOUS 3-STATE YES 16,32 2 µA 330 µA 1.17 V 1.06 V CMOS R-PBGA-B200 e1 85 °C -25 °C 260 30 200 PLASTIC/EPOXY VFBGA BGA200,12X20,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) BALL 800 µm BOTTOM 800 µm 14.5 mm 10 mm MICRON TECHNOLOGY INC VFBGA, BGA200,12X20,32/25 Compliant EAR99 8542.32.00.36