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MT53D512M32D2DS-053AWT:C
Micron Technology Inc
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Check for Price Buy | Yes | Active | 17.1799 Gbit | 32 | 512MX32 | 1.1 V | 1.866 GHz | SINGLE BANK PAGE BURST | LPDDR4 DRAM | SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX | COMMON | 16,32 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 16,32 | 2 µA | 330 µA | 1.17 V | 1.06 V | CMOS | R-PBGA-B200 | e1 | 85 °C | -25 °C | 260 | 30 | 200 | PLASTIC/EPOXY | VFBGA | BGA200,12X20,32/25 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) | BALL | 800 µm | BOTTOM | 800 µm | 14.5 mm | 10 mm | MICRON TECHNOLOGY INC | VFBGA, BGA200,12X20,32/25 | Compliant | EAR99 | 8542.32.00.36 | |||||
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MT53D512M32D2DS-053AWT:D
Micron Technology Inc
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Check for Price Buy | Yes | Active | 17.1799 Gbit | 32 | 512MX32 | 1.1 V | 1.866 GHz | SINGLE BANK PAGE BURST | LPDDR4 DRAM | SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX | COMMON | 16,32 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 16,32 | 2 µA | 330 µA | 1.17 V | 1.06 V | CMOS | R-PBGA-B200 | e1 | 85 °C | -25 °C | 260 | 30 | 200 | PLASTIC/EPOXY | VFBGA | BGA200,12X20,32/25 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) | BALL | 800 µm | BOTTOM | 800 µm | 14.5 mm | 10 mm | MICRON TECHNOLOGY INC | VFBGA, BGA200,12X20,32/25 | Compliant | EAR99 | 8542.32.00.36 | |||||
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MT53D512M32D2DS-053WT:C
Micron Technology Inc
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Check for Price Buy | Yes | Active | 17.1799 Gbit | 32 | 512MX32 | 1.1 V | 1.866 GHz | SINGLE BANK PAGE BURST | LPDDR4 DRAM | SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX | COMMON | 16,32 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 16,32 | 2 µA | 330 µA | 1.17 V | 1.06 V | CMOS | R-PBGA-B200 | e1 | 85 °C | -25 °C | 260 | 30 | 200 | PLASTIC/EPOXY | VFBGA | BGA200,12X20,32/25 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) | BALL | 800 µm | BOTTOM | 800 µm | 14.5 mm | 10 mm | MICRON TECHNOLOGY INC | VFBGA, BGA200,12X20,32/25 | Compliant | EAR99 | 8542.32.00.36 | |||||
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MT53D512M32D2DS-053WT:B
Micron Technology Inc
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Check for Price Buy | Yes | Active | 17.1799 Gbit | 32 | 512MX32 | 1.1 V | 1.866 GHz | SINGLE BANK PAGE BURST | LPDDR4 DRAM | SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX | COMMON | 16,32 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 16,32 | 2 µA | 330 µA | 1.17 V | 1.06 V | CMOS | R-PBGA-B200 | e1 | 85 °C | -25 °C | 260 | 30 | 200 | PLASTIC/EPOXY | VFBGA | BGA200,12X20,32/25 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) | BALL | 800 µm | BOTTOM | 800 µm | 14.5 mm | 10 mm | MICRON TECHNOLOGY INC | VFBGA, BGA200,12X20,32/25 | Compliant | EAR99 | 8542.32.00.36 | |||||
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MT53D512M32D2DS-053WT:A
Micron Technology Inc
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Check for Price Buy | Yes | Active | 17.1799 Gbit | 32 | 512MX32 | 1.1 V | 1.866 GHz | SINGLE BANK PAGE BURST | LPDDR4 DRAM | SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX | COMMON | 16,32 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 16,32 | 2 µA | 330 µA | 1.17 V | 1.06 V | CMOS | R-PBGA-B200 | e1 | 85 °C | -25 °C | 260 | 30 | 200 | PLASTIC/EPOXY | VFBGA | BGA200,12X20,32/25 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) | BALL | 800 µm | BOTTOM | 800 µm | 14.5 mm | 10 mm | MICRON TECHNOLOGY INC | VFBGA, BGA200,12X20,32/25 | Compliant | EAR99 | 8542.32.00.36 | |||||
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MT53D512M32D2DS-053AUT:D
Micron Technology Inc
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Check for Price Buy | Yes | Obsolete | 17.1799 Gbit | 32 | 512MX32 | 1.1 V | 1.866 GHz | LPDDR4 DRAM | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX | COMMON | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 16,32 | 2 µA | 330 µA | 1.17 V | 1.06 V | CMOS | AUTOMOTIVE | R-PBGA-B200 | 125 °C | -40 °C | AEC-Q100 | 200 | PLASTIC/EPOXY | VFBGA | BGA200,12X20,32/25 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 800 µm | 14.5 mm | 10 mm | MICRON TECHNOLOGY INC | WFBGA-200 | Compliant | EAR99 | 8542.32.00.36 | |||||||||
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MT53D512M32D2DS-053AWT:B
Micron Technology Inc
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Check for Price Buy | Yes | Active | 17.1799 Gbit | 32 | 512MX32 | 1.1 V | 1.866 GHz | SINGLE BANK PAGE BURST | LPDDR4 DRAM | SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX | COMMON | 16,32 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 16,32 | 2 µA | 330 µA | 1.17 V | 1.06 V | CMOS | R-PBGA-B200 | e1 | 85 °C | -25 °C | 260 | 30 | 200 | PLASTIC/EPOXY | VFBGA | BGA200,12X20,32/25 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) | BALL | 800 µm | BOTTOM | 800 µm | 14.5 mm | 10 mm | MICRON TECHNOLOGY INC | VFBGA, BGA200,12X20,32/25 | Compliant | EAR99 | 8542.32.00.36 | |||||
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MT53D512M32D2DS-053AIT:D
Micron Technology Inc
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Check for Price Buy | Yes | Obsolete | 17.1799 Gbit | 32 | 512MX32 | 1.1 V | 1.866 GHz | MULTI BANK PAGE BURST | LPDDR4 DRAM | SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX | COMMON | 16,32 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 16,32 | 2 µA | 330 µA | 1.17 V | 1.06 V | CMOS | R-PBGA-B200 | 95 °C | -40 °C | AEC-Q100 | 200 | PLASTIC/EPOXY | VFBGA | BGA200,12X22,32/25 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 800 µm | 14.5 mm | 10 mm | MICRON TECHNOLOGY INC | WFBGA-200 | Compliant | EAR99 | 8542.32.00.36 | ||||||||
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MT53D512M32D2DS-053WT:D
Micron Technology Inc
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Check for Price Buy | Yes | Obsolete | 17.1799 Gbit | 32 | 512MX32 | 1.1 V | 1.866 GHz | SINGLE BANK PAGE BURST | LPDDR4 DRAM | SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX | COMMON | 16,32 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 16,32 | 2 µA | 330 µA | 1.17 V | 1.06 V | CMOS | R-PBGA-B200 | 85 °C | -25 °C | 200 | PLASTIC/EPOXY | VFBGA | BGA200,12X20,32/25 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 800 µm | 14.5 mm | 10 mm | MICRON TECHNOLOGY INC | WFBGA-200 | Compliant | EAR99 | 8542.32.00.36 | Micron | ||||||||
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MT53D512M32D2DS-053AWT:A
Micron Technology Inc
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Check for Price Buy | Yes | Active | 17.1799 Gbit | 32 | 512MX32 | 1.1 V | 1.866 GHz | SINGLE BANK PAGE BURST | LPDDR4 DRAM | SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX | COMMON | 16,32 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 16,32 | 2 µA | 330 µA | 1.17 V | 1.06 V | CMOS | R-PBGA-B200 | e1 | 85 °C | -25 °C | 260 | 30 | 200 | PLASTIC/EPOXY | VFBGA | BGA200,12X20,32/25 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) | BALL | 800 µm | BOTTOM | 800 µm | 14.5 mm | 10 mm | MICRON TECHNOLOGY INC | VFBGA, BGA200,12X20,32/25 | Compliant | EAR99 | 8542.32.00.36 |