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XCF04SVOG20C
AMD Xilinx
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$2.8407 | Yes | Yes | Obsolete | 4.1943 Mbit | 1 | 4MX1 | 3.3 V | 33 MHz | CONFIGURATION MEMORY | 20 | 20000 Write/Erase Cycles | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | SERIAL | 3.3 V | 10 mA | 10 µA | 3.6 V | 3 V | CMOS | NOR TYPE | HARDWARE | R-PDSO-G20 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | TSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.19 mm | 6.5024 mm | 4.4 mm | XILINX INC | TSSOP | TSSOP-20 | 20 | compliant | EAR99 | 8542.32.00.51 | XILINX | |||||||||||
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XCF02SVOG20C
AMD Xilinx
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$7.4023 | Yes | Yes | Obsolete | 2.0972 Mbit | 1 | 2MX1 | 3.3 V | CONFIGURATION MEMORY | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL | 20 | 20000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | SERIAL | 1 mA | 10 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-G20 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | TSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.19 mm | 6.5024 mm | 4.4 mm | XILINX INC | TSSOP | LEAD-FREE, PLASTIC, TSSOP-20 | 20 | compliant | EAR99 | 8542.32.00.51 | XILINX | ||||||||||||
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AT24C02C-SSHM-T
Microchip Technology Inc
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$0.2713 | Yes | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 1 MHz | EEPROM | 100 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 256 | 256 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 2.5 V | I2C | 6 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | e4 | 1 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.925 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC-8 | compliant | EAR99 | 8542.32.00.51 | Microchip | 2016-12-07 | ||||||||||
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M24M02-DRMN6TP
STMicroelectronics
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$1.8957 | Yes | Active | 2.0972 Mbit | 8 | 256KX8 | 2.5 V | 1 MHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DMMR | 1 | 256000 | 262.144 k | SYNCHRONOUS | SERIAL | I2C | 2 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 10 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | SOP-8 | compliant | 3A991.B.1.B.1 | 8542.32.00.51 | STMicroelectronics | ||||||||||||
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XCF32PVOG48C
AMD Xilinx
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$33.8039 | Yes | Yes | Obsolete | 33.5544 Mbit | 1 | 32MX1 | 1.8 V | CONFIGURATION MEMORY | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL | 20 | 20000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 1 mA | 40 µA | 2 V | 1.65 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.45 mm | 12 mm | XILINX INC | TSOP | LEAD-FREE, PLASTIC, TSOP-48 | 48 | compliant | 3A991.B.1.A | 8542.32.00.51 | XILINX | ||||||||||||
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AT25512N-SH-T
Atmel Corporation
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$1.3507 | Yes | Yes | Transferred | 524.288 kbit | 8 | 64KX8 | 2.7 V | 5 MHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1 | 64000 | 65.536 k | SYNCHRONOUS | SERIAL | SPI | 3 µA | 10 µA | 3.6 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | ATMEL CORP | SOIC | 0.150 INCH, HALOGEN AND LEAD FREE, PLASTIC, MS-012AA, SOIC-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||||||
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XCF32PFSG48C
AMD Xilinx
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$33.8039 | Yes | Yes | Obsolete | 33.5544 Mbit | 1 | 32MX1 | 1.8 V | 50 MHz | CONFIGURATION MEMORY | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL | 20 | 20000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 1.8 V | 40 µA | 2 V | 1.65 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE | R-PBGA-B48 | Not Qualified | e2 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 8 mm | XILINX INC | BGA | TFBGA-48 | 48 | compliant | 3A991.B.1.A | 8542.32.00.51 | XILINX | |||||||||
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XCF01SVOG20C
AMD Xilinx
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$1.8758 | Yes | Yes | Obsolete | 1.0486 Mbit | 1 | 1MX1 | 3.3 V | CONFIGURATION MEMORY | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL | 20 | 20000 Write/Erase Cycles | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | SERIAL | 1 mA | 10 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-G20 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | TSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.19 mm | 6.5024 mm | 4.4 mm | XILINX INC | TSSOP | LEAD-FREE, PLASTIC, TSSOP-20 | 20 | compliant | EAR99 | 8542.32.00.51 | XILINX | ||||||||||||
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AT24CM01-XHM-T
Atmel Corporation
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$2.8975 | Yes | Transferred | 1.0486 Mbit | 8 | 128KX8 | 5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDMR | 1 | 128000 | 131.072 k | SYNCHRONOUS | SERIAL | I2C | 1 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | ATMEL CORP | TSSOP | TSSOP, TSSOP8,.25 | 8 | unknown | EAR99 | 8542.32.00.51 | Microchip | |||||||||||
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AT24CM01-SHD-B
Microchip Technology Inc
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$1.6659 | Yes | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 5 V | 1 MHz | EEPROM | 1.7V TO 5.5V @ 0.4MHz | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 128000 | 131.072 k | SYNCHRONOUS | SERIAL | 5 V | I2C | 1 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.29 mm | 5.24 mm | MICROCHIP TECHNOLOGY INC | 0.208 INCH, GREEN, PLASTIC, SOIC-8 | compliant | Microchip |