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Part Number |
Composite Price
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Rohs Code
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Part Life Cycle Code
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Memory Density
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Memory Width | Organization |
Supply Voltage-Nom (Vsup)
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Memory IC Type
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Number of Functions | Number of Words Code | Number of Words |
Operating Mode
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Parallel/Serial
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Programming Voltage
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Supply Voltage-Max (Vsup)
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Supply Voltage-Min (Vsup)
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Technology |
Temperature Grade
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JESD-30 Code
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Length
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Width
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Package Description
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Reach Compliance Code
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ECCN Code
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HTS Code
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H26M52208FPR
SK Hynix Inc
|
Check for Price | Yes | Active | 137.439 Gbit | 8 | 16GX8 | 3.3 V | FLASH | 1 | 16000000000 | 17.1799 G | SYNCHRONOUS | PARALLEL | 3.3 V | 3.6 V | 2.7 V | CMOS | OTHER | R-PBGA-B153 | 85 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 153 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 500 µm | BOTTOM | 800 µm | 13 mm | 11.5 mm | VFBGA, | compliant | EAR99 | 8542.32.00.51 |