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Parametric results for: SDINBDG4-8G under Flash Memories

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Manufacturer Part Number: sdinbdg48g
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SDINBDG4-8G-XI1
 SanDisk Corporation 		$8.7900 Yes Transferred 68.7195 Gbit 8 8GX8 3.3 V 200 MHz Embedded MMC 3000 Write/Erase Cycles 1 8000000000 8.5899 G SYNCHRONOUS SERIAL 3.3 V EMMC 5.1 3.6 V 2.7 V CMOS MLC NAND TYPE R-PBGA-B153 85 °C -40 °C 153 PLASTIC/EPOXY VFBGA BGA153,14X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER NICKEL GERMANIUM BALL 500 µm BOTTOM 800 µm 13 mm 11.5 mm SANDISK CORP VFBGA-153 unknown EAR99 8542.32.00.51 SanDisk
SDINBDG4-8G-I1
 Western Digital Corp 		Check for Price Yes Active 68.7195 Gbit 8 8GX8 3.3 V 200 MHz Embedded MMC 1 3000 Write/Erase Cycles 1 8000000000 8.5899 G SYNCHRONOUS SERIAL 3.3 V EMMC 5.1 3.6 V 2.7 V CMOS MLC NAND TYPE R-PBGA-B153 85 °C -25 °C 153 PLASTIC/EPOXY VFBGA BGA153,14X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 13 mm 11.5 mm WESTERN DIGITAL CORP VFBGA-153 compliant EAR99 8542.32.00.51 WESTERN DIGITAL
SDINBDG4-8G-I1T
 Western Digital Corp 		Check for Price Yes Active 68.7195 Gbit 8 8GX8 3.3 V 200 MHz Embedded MMC 1 3000 Write/Erase Cycles 1 8000000000 8.5899 G SYNCHRONOUS SERIAL 3.3 V EMMC 5.1 3.6 V 2.7 V CMOS MLC NAND TYPE R-PBGA-B153 3 85 °C -25 °C 153 PLASTIC/EPOXY VFBGA BGA153,14X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 13 mm 11.5 mm WESTERN DIGITAL CORP VFBGA-153 compliant WESTERN DIGITAL
SDINBDG4-8G-I1
 SanDisk Corporation 		Check for Price Transferred 68.7195 Gbit 8 8GX8 3.3 V 200 MHz Embedded MMC 3000 Write/Erase Cycles 1 8000000000 8.5899 G SYNCHRONOUS SERIAL 3.3 V EMMC 5.1 3.6 V 2.7 V CMOS MLC NAND TYPE R-PBGA-B153 85 °C -25 °C 153 PLASTIC/EPOXY VFBGA BGA153,14X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 13 mm 11.5 mm SANDISK CORP VFBGA-153 unknown EAR99 8542.32.00.51 SanDisk
SDINBDG4-8G-ZA
 Western Digital Corp 		Check for Price Yes Active 68.7195 Gbit 8 8GX8 3.3 V 200 MHz Embedded MMC 15 3000 Write/Erase Cycles 1 8000000000 8.5899 G SYNCHRONOUS SERIAL 3.3 V EMMC 5.1 3.6 V 2.7 V CMOS INDUSTRIAL MLC NAND TYPE R-PBGA-B153 85 °C -25 °C AEC-Q100 153 PLASTIC/EPOXY VFBGA BGA153,14X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 13 mm 11.5 mm WESTERN DIGITAL CORP VFBGA-153 unknown EAR99 8542.32.00.51 WESTERN DIGITAL
SDINBDG4-8G-XI
 Western Digital Corp 		Check for Price Yes Active 68.7195 Gbit 8 8GX8 3.3 V 200 MHz Embedded MMC 3000 Write/Erase Cycles 1 8000000000 8.5899 G SYNCHRONOUS SERIAL 3.3 V EMMC 5.1 3.6 V 2.7 V CMOS MLC NAND TYPE R-PBGA-B153 85 °C -40 °C 153 PLASTIC/EPOXY VFBGA BGA153,14X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 13 mm 11.5 mm WESTERN DIGITAL CORP unknown WESTERN DIGITAL
SDINBDG4-8G-XI1Q
 Western Digital Corp 		Check for Price Active 68.7195 Gbit 8 8GX8 3.3 V 200 MHz Embedded MMC 1 3000 Write/Erase Cycles 1 8000000000 8.5899 G SYNCHRONOUS SERIAL 3.3 V EMMC 5.1 3.6 V 2.7 V CMOS MLC NAND TYPE R-PBGA-B153 85 °C -40 °C 153 PLASTIC/EPOXY VFBGA BGA153,14X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 13 mm 11.5 mm WESTERN DIGITAL CORP , unknown EAR99 8542.32.00.51
SDINBDG4-8G-XI1
 Western Digital Corp 		Check for Price Yes Active 68.7195 Gbit 8 8GX8 3.3 V 200 MHz Embedded MMC 1 3000 Write/Erase Cycles 1 8000000000 8.5899 G SYNCHRONOUS SERIAL 3.3 V EMMC 5.1 3.6 V 2.7 V CMOS MLC NAND TYPE R-PBGA-B153 85 °C -40 °C 153 PLASTIC/EPOXY VFBGA BGA153,14X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER NICKEL GERMANIUM BALL 500 µm BOTTOM 800 µm 13 mm 11.5 mm WESTERN DIGITAL CORP VFBGA-153 compliant EAR99 8542.32.00.51 WESTERN DIGITAL
SDINBDG4-8G-I1Q
 Western Digital Corp 		Check for Price Contact Manufacturer 68.7195 Gbit 8 8GX8 3.3 V 200 MHz Embedded MMC 1 3000 Write/Erase Cycles 1 8000000000 8.5899 G SYNCHRONOUS SERIAL 3.3 V EMMC 5.1 3.6 V 2.7 V CMOS MLC NAND TYPE R-PBGA-B153 85 °C -25 °C 153 PLASTIC/EPOXY VFBGA BGA153,14X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 13 mm 11.5 mm WESTERN DIGITAL CORP , unknown EAR99 8542.32.00.51
SDINBDG4-8G-I
 Western Digital Corp 		Check for Price Active 68.7195 Gbit 8 8GX8 3.3 V 200 MHz Embedded MMC 1 3000 Write/Erase Cycles 1 8000000000 8.5899 G SYNCHRONOUS SERIAL 3.3 V EMMC 5.1 3.6 V 2.7 V CMOS MLC NAND TYPE R-PBGA-B153 85 °C -25 °C 153 PLASTIC/EPOXY VFBGA BGA153,14X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 13 mm 11.5 mm WESTERN DIGITAL CORP , unknown EAR99 8542.32.00.51
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