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TE28F160B3BD70
Intel Corporation
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Check for Price Buy | No | Transferred | 16.7772 Mbit | 16 | 4K,32K | 1MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | NO | 1 | 8,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 2.7 V | 5 µA | 55 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | NOR TYPE | R-PDSO-G48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | TSOP | TSSOP, TSSOP48,.8,20 | 48 | Compliant | EAR99 | 8542.32.00.51 | ||||
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TE28F160B3BD70
Numonyx Memory Solutions
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Check for Price Buy | Obsolete | 16.7772 Mbit | 16 | 1MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 2.7 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-G48 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | TSOP | 12 X 20 MM, TSOP-48 | 48 | Unknown | EAR99 | 8542.32.00.51 |