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KM23V8100C-25
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 16 | 512KX16 | 3.3 V | 250 ns | MASK ROM | 8 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 50 µA | 30 µA | CMOS | COMMERCIAL | R-PDIP-T42 | Not Qualified | e0 | 3 | 70 °C | 42 | PLASTIC/EPOXY | DIP | DIP42,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | SAMSUNG SEMICONDUCTOR INC | DIP, DIP42,.6 | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||
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K3N6C1000F-GC12
Samsung Semiconductor
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Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 5 V | 120 ns | MASK ROM | 8 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 50 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | e0 | 70 °C | 44 | PLASTIC/EPOXY | SOP | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3.1 mm | 28.5 mm | 12.6 mm | SAMSUNG SEMICONDUCTOR INC | SOP, SOP44,.63 | compliant | EAR99 | 8542.32.00.71 | SOIC | 44 | |||||||||
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UPD23C64380F9-XXX-BC3-A
NEC Electronics America Inc
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Check for Price | Yes | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 100 ns | MASK ROM | 8 | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 40 µA | MOS | COMMERCIAL | R-PBGA-B48 | Not Qualified | e1 | 70 °C | -10 °C | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.07 mm | 8 mm | 6 mm | NEC ELECTRONICS AMERICA INC | 8 X 6 MM, LEAD FREE, FBGA-48 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||
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KM23V8001BG-20
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 8 | 1MX8 | 3.3 V | 200 ns | MASK ROM | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 30 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | R-PDSO-G32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | SOP | SOP32,.56 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3 mm | 20.47 mm | 11.43 mm | SAMSUNG SEMICONDUCTOR INC | SOP, SOP32,.56 | unknown | EAR99 | 8542.32.00.71 | SOIC | 32 | ||||||||
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TC5316200F(TP2)
Toshiba America Electronic Components
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Check for Price | No | No | Active | 16.7772 Mbit | 8 | 2MX8 | 5 V | 200 ns | MASK ROM | 16 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 60 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | e0 | 70 °C | 44 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3.1 mm | 28.2 mm | 12.6 mm | TOSHIBA CORP | 0.600 INCH, PLASTIC, SOP-44 | unknown | EAR99 | 8542.32.00.71 | SOIC | 44 | |||||||||
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LH534100BD-20
Sharp Corp
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Check for Price | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 200 ns | MASK ROM | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.2 mm | 41 mm | 15.24 mm | SHARP CORP | 0.600 INCH, PLASTIC, DIP-32 | unknown | |||||||||||||||
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KM23C4100CT-10
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 4.1943 Mbit | 16 | 256KX16 | 5 V | 100 ns | MASK ROM | 8 | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 50 µA | 60 µA | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | e0 | 3 | 70 °C | 44 | PLASTIC/EPOXY | TSOP | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 800 µm | DUAL | SAMSUNG SEMICONDUCTOR INC | TSOP, TSOP44,.46,32 | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||
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UM23C2101
United Microelectronics Corporation
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Check for Price | Obsolete | 2.0972 Mbit | 8 | 256KX8 | 5 V | 120 ns | MASK ROM | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T32 | Not Qualified | 70 °C | 32 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | UNITED MICROELECTRONICS CORP | , | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||||||||
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TC5332200AFT
Toshiba America Electronic Components
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Check for Price | No | Obsolete | 33.5544 Mbit | 8 | 4MX8 | 5 V | 120 ns | MASK ROM | TTL COMPATIBLE I/O; ALSO CONFIGURABLE AS 2M X 16 | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | e0 | 70 °C | -10 °C | 240 | NOT SPECIFIED | 44 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | TOSHIBA CORP | 0.400 INCH, PLASTIC, TSOP2-44 | unknown | TSOP2 | 44 | |||||||||||
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KM23S32000BETY-12
Samsung Semiconductor
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Check for Price | Obsolete | 33.5544 Mbit | 8 | 4MX8 | 2.5 V | 120 ns | MASK ROM | TTL COMPATIBLE I/O; CONFIGURABLE AS 2M X 16 | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 30 µA | 2.7 V | 2.3 V | CMOS | OTHER | R-PDSO-G48 | Not Qualified | 85 °C | -20 °C | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 16.4 mm | 12 mm | SAMSUNG SEMICONDUCTOR INC | TSOP1, | unknown | EAR99 | 8542.32.00.71 | TSOP1 | 48 |