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Compare Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
Part Number Composite Price
Pbfree Code
Rohs Code
Part Life Cycle Code
Memory Density
Memory Width Organization Supply Voltage-Nom (Vsup)
Power Supplies
Access Time-Max
Clock Frequency-Max (fCLK) Memory IC Type
Additional Feature
Data Retention Time-Min
Endurance
Number of Functions Number of Words Code Number of Words Operating Mode
Parallel/Serial
Serial Bus Type
Standby Current-Max
Standby Voltage-Min
Supply Current-Max
Supply Voltage-Max (Vsup)
Supply Voltage-Min (Vsup)
Technology Temperature Grade
Write Protection
JESD-30 Code
Qualification Status
JESD-609 Code
Moisture Sensitivity Level
Operating Temperature-Max
Operating Temperature-Min
Screening Level
Number of Terminals
Package Body Material
Package Code
Package Equivalence Code
Package Shape
Package Style
Surface Mount
Terminal Finish
Terminal Form
Terminal Pitch
Terminal Position
Seated Height-Max
Length
Width
Package Description
Reach Compliance Code
ECCN Code
HTS Code
Part Package Code
Pin Count
Source Content uid
28C010TRPGI-175
Maxwell Technologies
Check for Price Transferred , unknown EAR99 8542.32.00.71
5962-01-295-8581
AMD
Check for Price No Obsolete 16.384 kbit 8 2KX8 5 V 5 V 50 ns MEMORY CIRCUIT 2000 2.048 k TTL MILITARY R-XDIP-T24 Not Qualified 125 °C -55 °C 38535Q/M;38534H;883B 24 CERAMIC DIP DIP24,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL DIP, DIP24,.3 compliant EAR99 8542.32.00.71
DS6204U-4
Dallas Semiconductor
Check for Price Transferred 256 bit 1 256X1 MEMORY CIRCUIT DATA RETENTION > 10 YEARS 1 256 256 words CMOS COMMERCIAL X-XSSS-X5 Not Qualified 70 °C 5 UNSPECIFIED UNSPECIFIED SPECIAL SHAPE NO UNSPECIFIED SINGLE unknown EAR99 8542.32.00.71
S71NS64JA0BAW232
Spansion
Check for Price No No Obsolete 67.1089 Mbit 16 4MX16 1.8 V MEMORY CIRCUIT PSRAM IS ORGANIZED AS 1M X 16, SYNCHRONOUS BURST MODE ALSO POSSIBLE 1 4000000 4.1943 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B44 Not Qualified e0 3 85 °C -25 °C 44 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 500 µm BOTTOM 1.2 mm 9.2 mm 8 mm TFBGA, compliant EAR99 8542.32.00.71 BGA 44
S71WS256ND0BAWYU3
Spansion
Check for Price Yes Obsolete 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT PSRAM IS ORGANIZED AS 8M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE 1 16000000 16.7772 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B84 Not Qualified e1 3 85 °C -25 °C 84 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 12 mm 9 mm TFBGA, compliant EAR99 8542.32.00.71 BGA 84
Z8038AD1N
STMicroelectronics
Check for Price No Obsolete 1.024 kbit 8 128X8 5 V 5 V 6 MHz MEMORY CIRCUIT 1 128 128 words ASYNCHRONOUS 250 µA 5.25 V 4.75 V CMOS COMMERCIAL R-CDIP-T40 Not Qualified e0 70 °C 40 CERAMIC, METAL-SEALED COFIRED DIP DIP40,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 15.24 mm CERAMIC, DIP-40 not_compliant EAR99 8542.32.00.71 DIP 40 Z8038AD1N
71WS512NC0BFWAH2
Spansion
Check for Price Obsolete 536.8709 Mbit 8 64MX8 1.8 V MEMORY CIRCUIT 1 64000000 67.1089 M SYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B84 Not Qualified 85 °C -25 °C 84 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 11.6 mm 8 mm TFBGA, unknown EAR99 8542.32.00.71 BGA 84
WSF512K16X-39H2I
White Microelectronics
Check for Price Transferred 8.3886 Mbit 16 512KX16 5 V MEMORY CIRCUIT ALSO CONFIGURABLE AS 1MX8 1 512000 524.288 k ASYNCHRONOUS 5.5 V 4.5 V CMOS INDUSTRIAL S-CHMA-P66 Not Qualified 85 °C -40 °C 66 CERAMIC, METAL-SEALED COFIRED SQUARE MICROELECTRONIC ASSEMBLY NO PIN/PEG HEX 1.385 INCH SQUARE, HERMETIC SEALED, CERAMIC, HIP-66 unknown EAR99 8542.32.00.71
MB85RC16VPNF-G-JNERE1
FUJITSU Semiconductor Limited
Check for Price Transferred 16.384 kbit 8 2KX8 5 V 1 MHz FRAM 2kv ESD available;Also available with 3v min supply 10 1000000000000 Write/Erase Cycles 1 2000 2.048 k SYNCHRONOUS SERIAL I2C 10 µA 4.5 V 130 nA 5.5 V 4.5 V CMOS HARDWARE R-PDSO-G8 Not Qualified 85 °C -40 °C 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 1.75 mm 5.05 mm 3.9 mm SOP, unknown EAR99 8542.32.00.71 SOIC 8
MT28C256532W18DFT-F605P70BTWT
Micron Technology Inc
Check for Price Obsolete 134.2177 Mbit 16 8MX16 MEMORY CIRCUIT CELLULARRAM IS ORGANIZED AS 2M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH 1 8000000 8.3886 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B88 Not Qualified e1 85 °C -25 °C 88 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.4 mm 12 mm 9 mm LFBGA, unknown EAR99 8542.32.00.71 BGA 88

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