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CY7C09169AV-12AXC
Rochester Electronics LLC
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Check for Price | Active | 147.456 kbit | 9 | 16KX9 | 3.3 V | 25 ns | DUAL-PORT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 1 | 16000 | 16.384 k | SYNCHRONOUS | PARALLEL | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G100 | COMMERCIAL | e3/e4 | 70 °C | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN/NICKEL PALLADIUM GOLD | GULL WING | 500 µm | QUAD | 1.6 mm | 14 mm | 14 mm | ROCHESTER ELECTRONICS LLC | QFP | PLASTIC, LEAD FREE, TQFP-100 | 100 | unknown | ||||||||||||||||||||||
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CY7C1061GE18-15BVXI
Cypress Semiconductor
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$26.6490 | Yes | Transferred | 16.7772 Mbit | 16 | 1MX16 | 1.8 V | 15 ns | STANDARD SRAM | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 2.2 V | 1.65 V | CMOS | INDUSTRIAL | R-PBGA-B48 | e1 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 750 µm | BOTTOM | 1 mm | 8 mm | 6 mm | CYPRESS SEMICONDUCTOR CORP | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||||||||||
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FT6164-15PC
Force Technologies Ltd
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Check for Price | Active | 65.536 kbit | 8 | 8KX8 | 5 V | 15 ns | STANDARD SRAM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 30 mA | 2 V | 160 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T28 | 70 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 34.8615 mm | 7.62 mm | FORCE TECHNOLOGIES LTD | DIP | , | 28 | compliant | EAR99 | 8542.32.00.41 | |||||||||||||||||
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GS8128436B-200IT
GSI Technology
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Check for Price | No | No | Active | 150.9949 Mbit | 36 | 4MX36 | 2.5 V | 7.5 ns | CACHE SRAM | PIPELINE AND FLOW THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3V TO 3.6V SUPPLY | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | PARALLEL | 2.7 V | 2.3 V | CMOS | INDUSTRIAL | R-PBGA-B119 | Not Qualified | e0 | 85 °C | -40 °C | 119 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 1.99 mm | 22 mm | 14 mm | GSI TECHNOLOGY | BGA | BGA, | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||||||
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71016S15Y8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 1.0486 Mbit | 16 | 64KX16 | 5 V | 15 ns | STANDARD SRAM | COMMON | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 10 mA | 4.5 V | 180 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-J44 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 44 | PLASTIC/EPOXY | SOJ | SOJ44,.44 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn85Pb15) | J BEND | 1.27 mm | DUAL | 3.683 mm | 28.575 mm | 10.16 mm | INTEGRATED DEVICE TECHNOLOGY INC | SOJ | 0.400 INCH, PLASTIC, SOJ-44 | 44 | not_compliant | 3A991.B.2.B | 8542.32.00.41 | ||||||||||
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71V3557S85PFG8
Integrated Device Technology Inc
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$4.9612 | Yes | Yes | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 8.5 ns | 90 MHz | CACHE SRAM | FLOW-THROUGH ARCHITECTURE | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 225 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | 14 X 20 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-100 | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | PKG100 | 1998-08-01 | ||||||
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WED2DL36514V38BC
White Electronic Designs Corp
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Check for Price | No | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 3.3 V | 3.8 ns | STANDARD SRAM | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 119 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | BALL | 1.27 mm | BOTTOM | 2.794 mm | 22 mm | 14 mm | WHITE ELECTRONIC DESIGNS CORP | PLASTIC, BGA-119 | unknown | ||||||||||||||||||||||||
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K6F4016U4D-FF550
Samsung Semiconductor
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Check for Price | No | Obsolete | 4.1943 Mbit | 16 | 256KX16 | 3 V | 55 ns | STANDARD SRAM | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 3.3 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 750 µm | BOTTOM | 1.2 mm | 8.5 mm | 6.1 mm | SAMSUNG SEMICONDUCTOR INC | BGA | TFBGA, | 48 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||||||||||
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UPD44324184F5-E50-EQ2-A
NEC Electronics America Inc
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Check for Price | Yes | Transferred | 37.7487 Mbit | 18 | 2MX18 | 1.8 V | 450 ps | DDR SRAM | PIPELINED ARCHITECTURE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | PARALLEL | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 70 °C | 165 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.51 mm | 15 mm | 13 mm | NEC ELECTRONICS AMERICA INC | 13 X 15 MM, LEAD FREE, PLASTIC, BGA-165 | compliant | |||||||||||||||||||||||
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5962D9960703TUX
Cobham Power Products
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Check for Price | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 3.3 V | 20 ns | STANDARD SRAM | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3.6 V | 3 V | CMOS | MILITARY | R-CDFP-F36 | Not Qualified | 125 °C | -55 °C | MIL-PRF-38535 Class T | 10k Rad(Si) V | 36 | CERAMIC, METAL-SEALED COFIRED | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 1.27 mm | DUAL | 3.048 mm | 12.192 mm | AEROFLEX PLAINVIEW | DFP | DFP, | 36 | unknown | 3A001.A.2.C | 8542.32.00.41 |