Parametric results for: Microprocessors

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MPC8547ECVJAQGD
NXP Semiconductors
$199.6171 Yes Obsolete 32 1 GHz YES MICROPROCESSOR, RISC CMOS S-PBGA-B783 Not Qualified 3 260 40 783 PLASTIC/EPOXY BGA BGA783,28X28,40 SQUARE GRID ARRAY BALL 1 mm BOTTOM NXP SEMICONDUCTORS BGA, BGA783,28X28,40 compliant 5A002.A.1 8542.31.00.01 NXP
MCF52277CVM160
NXP Semiconductors
$13.7183 Yes Not Recommended 32 166.67 MHz 32 24 66.67 MHz YES 1.5 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES NO 700 µA 1.6 V 1.4 V INDUSTRIAL S-PBGA-B196 Not Qualified e1 3 85 °C -40 °C 260 40 196 PLASTIC/EPOXY LFBGA BGA196,14X14,40 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 500 µm BOTTOM 1.7 mm 15 mm 15 mm NXP SEMICONDUCTORS 15 X 15 MM, ROHS COMPLIANT, MAPBGA-196 compliant 3A991.A.2 8542.31.00.01
P1014PSE5HHB
NXP Semiconductors
Check for Price Active 32 800 MHz 100 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV S-PBGA-B425 e2 105 °C 425 PLASTIC/EPOXY FBGA SQUARE GRID ARRAY, FINE PITCH TIN SILVER BALL 800 µm BOTTOM 1.9 mm 19 mm 19 mm NXP SEMICONDUCTORS FBGA, unknown 3A991.A.2 8542.31.00.01
STP1020APGA-50
Sun Microsystems Inc
Check for Price Obsolete 32 50 MHz 0 64 36 50 MHz NO 4.8 V MICROPROCESSOR, RISC BICMOS YES FLOATING POINT NO NO 15 2.5 A 4.85 V 4.75 V S-CPGA-P293 Not Qualified 293 CERAMIC, METAL-SEALED COFIRED PGA SPGA293,35X35MOD SQUARE GRID ARRAY PIN/PEG 2.54 mm PERPENDICULAR 9.79 mm 47.24 mm 47.24 mm SUN MICROSYSTEMS INC PGA, SPGA293,35X35MOD unknown 3A991.A.2 8542.31.00.01 PGA 293
PX4080ME3NKB
e2v technologies
Check for Price Obsolete 1.333 GHz 64 16 133.3 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.05 V 950 mV MILITARY S-PBGA-B1295 e1 125 °C -55 °C 1295 PLASTIC/EPOXY BGA SQUARE GRID ARRAY TIN SILVER COPPER BALL 1 mm BOTTOM 3.53 mm 37.5 mm 37.5 mm E2V TECHNOLOGIES PLC BGA, unknown 3A991.A.2 8542.31.00.01
MC68000LC8
Motorola Mobility LLC
Check for Price No Obsolete 32 8 MHz 0 16 23 8 MHz NO 5 V MICROPROCESSOR CMOS NO FIXED POINT NO NO 7 25 mA 5.25 V 4.75 V COMMERCIAL R-CDIP-T64 Not Qualified e0 70 °C 64 CERAMIC, METAL-SEALED COFIRED DIP DIP64,.9 RECTANGULAR IN-LINE TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.32 mm 22.86 mm 81.28 mm MOTOROLA INC DIP, DIP64,.9 unknown 8542.31.00.01 DIP 64
XPC603VRC200E
Motorola Mobility LLC
Check for Price Obsolete 32 200 MHz 64 32 200 MHz NO 2.6 V MICROPROCESSOR, RISC CMOS ALSO REQUIRES 3.3 TO 3.465 VOLTS FOR I/O OPERATION YES YES 2.73 V R-CPGA-P288 Not Qualified 288 CERAMIC, METAL-SEALED COFIRED PGA RECTANGULAR GRID ARRAY PIN/PEG 2.54 mm PERPENDICULAR 44.704 mm 63.881 mm MOTOROLA INC PGA, unknown 3A991.A.2 8542.31.00.01 PGA 288
T4240MN7PT5B
e2v technologies
Check for Price Active MICROPROCESSOR, RISC TELEDYNE E2V (UK) LTD , compliant 8542.31.00.01 2019-01-16
P4081VE3PMB
e2v technologies
Check for Price Obsolete 1.5 GHz 64 16 133.3 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.05 V 950 mV S-PBGA-B1295 e1 1295 PLASTIC/EPOXY BGA SQUARE GRID ARRAY TIN SILVER COPPER BALL 1 mm BOTTOM 3.53 mm 37.5 mm 37.5 mm TELEDYNE E2V (UK) LTD 37.50 X 37.50 MM, 3.53 MM HEIGHT, 1 MM PITCH, PLASTIC, FCBGA-1295 compliant 3A991.A.2 8542.31.00.01
ACT-5260PC-133F24T
Cobham PLC
Check for Price Obsolete 64 133 MHz 64 64 75 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 3.465 V 3.135 V MILITARY S-CQFP-G208 Not Qualified 125 °C -55 °C 208 CERAMIC, METAL-SEALED COFIRED FQFP SQUARE FLATPACK, FINE PITCH GULL WING 500 µm QUAD 3.531 mm 28.448 mm 28.448 mm COBHAM PLC FQFP, unknown 3A991.A.2 8542.31.00.01