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TC399XX256F300SBDLXUMA1
Infineon Technologies AG
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Check for Price | Yes | Not Recommended | 32 | 300 MHz | 16777216 | 917504 | TC39 | 32 | 24 | 40 MHz | 275 | 9 | YES | 1.25 V | MICROCONTROLLER | CMOS | YES | NO | YES | FLOATING-POINT | YES | YES | YES | 128 | 12 | 8 | 8 | YES | FLASH | 835 mA | 1.375 V | 1.125 V | AUTOMOTIVE | S-PBGA-B516 | e2 | 3 | 150 °C | -40 °C | NOT SPECIFIED | AEC-Q100 | NOT SPECIFIED | 516 | PLASTIC/EPOXY | LFBGA | BGA516,30X30,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver (Sn/Ag) | BALL | 800 µm | BOTTOM | 1.7 mm | 25 mm | 25 mm | INFINEON TECHNOLOGIES AG | LFBGA-516 | compliant | Infineon | ||||||
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935317314557
NXP Semiconductors
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Check for Price | Not Recommended | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER | CMOS | ALSO OPERATES AT 3.3 V | NO | YES | YES | 8 | YES | FLASH | 875 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | AEC-Q100 | 40 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | unknown | 8542.31.00.01 | |||||||||||||||
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SPC5554MVR132
NXP Semiconductors
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$60.2630 | Yes | Not Recommended | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER | CMOS | ALSO OPERATES AT 3.3 V | NO | YES | YES | 8 | YES | FLASH | 875 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | AEC-Q100 | 40 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034AAL-1, TEPBGA-416 | compliant | NXP | 8542.31.00.01 | 3A991.A.2 | |||||||||||
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935309596557
NXP Semiconductors
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Check for Price | Not Recommended | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead/Silver (Sn/Pb/Ag) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | unknown | 8542.31.00.01 | ||||||||||||||||
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MPC5554MVR132
NXP Semiconductors
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$70.5387 | Yes | Not Recommended | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEPBGA-416 | compliant | NXP | 8542.31.00.01 | 3A991.A.2 | ||||||||||||
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MPC5554AZP132
NXP Semiconductors
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$306.4720 | No | Not Recommended | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | MILITARY | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -55 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEPBGA-416 | unknown | NXP | 8542.31.00.01 | 3A991.A.2 | ||||||||||||
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MPC5554MZP112
NXP Semiconductors
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$58.2867 | No | Not Recommended | 32 | 112 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEPBGA-416 | unknown | NXP | 8542.31.00.01 | 3A991.A.2 | ||||||||||||
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935309507557
NXP Semiconductors
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Check for Price | Not Recommended | 32 | 112 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | unknown | 8542.31.00.01 | ||||||||||||||||
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935319212557
NXP Semiconductors
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Check for Price | Not Recommended | 32 | 80 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | unknown | 8542.31.00.01 | |||||||||||||||||
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935322743557
NXP Semiconductors
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Check for Price | Not Recommended | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | unknown | 8542.31.00.01 |