Parametric results for: R4F24569NVRFQV under Microcontrollers

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Part Number Composite Price
Rohs Code
Part Life Cycle Code
Bit Size Speed ROM (words) RAM (bytes) External Data Bus Width
Address Bus Width Clock Frequency-Max
Number of I/O Lines Surface Mount
Supply Voltage-Nom uPs/uCs/Peripheral ICs Type
Technology Additional Feature
DAC Channels DMA Channels Has ADC On Chip Program ROM Width
Power Supplies
PWM Channels ROM Programmability
Supply Current-Max
Supply Voltage-Max
Supply Voltage-Min
Temperature Grade
JESD-30 Code
Qualification Status
JESD-609 Code
Moisture Sensitivity Level
Operating Temperature-Max
Operating Temperature-Min
Peak Reflow Temperature (Cel)
Time@Peak Reflow Temperature-Max (s)
Number of Terminals
Package Body Material
Package Code
Package Equivalence Code
Package Shape
Package Style
Terminal Finish
Terminal Form
Terminal Pitch
Terminal Position
Seated Height-Max
Width
Length
Ihs Manufacturer
Package Description
Reach Compliance Code
HTS Code
Source Content uid
935319429557
NXP Semiconductors
Check for Price Active 32 132 MHz 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER YES YES YES 1.65 V 1.35 V e1 3 260 40 416 HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS HBGA, unknown 8542.31.00.01
MPC5566MZP112R
NXP Semiconductors
Check for Price No Active 32 112 MHz 3145728 131072 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER CMOS ADC 40-CH IS AVAILABLE NO YES YES 8 1.5,3.3,5 V YES FLASH 820 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified 125 °C -40 °C 416 PLASTIC/EPOXY HBGA BGA416,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEBGA-416 unknown 8542.31.00.01 MPC5566MZP112R
935316969557
NXP Semiconductors
Check for Price Active 32 80 MHz 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER YES YES YES 1.65 V 1.35 V 416 HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS HBGA, unknown 8542.31.00.01
935317056518
NXP Semiconductors
Check for Price Obsolete 32 112 MHz 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER YES YES YES 1.65 V 1.35 V 416 HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS HBGA, unknown 8542.31.00.01
935325464557
NXP Semiconductors
Check for Price Active 32 144 MHz 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER YES YES YES 1.65 V 1.35 V 416 HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS HBGA, unknown 8542.31.00.01
935309958557
NXP Semiconductors
Check for Price Active 32 144 MHz 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER YES YES YES 1.65 V 1.35 V e4 3 260 40 416 HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG NICKEL GOLD BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS HBGA, unknown 8542.31.00.01
MPC5566MVR112R
NXP Semiconductors
Check for Price Yes Active 32 114 MHz 3145728 131072 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER, RISC CMOS YES YES 1.5,3.3,5 V YES FLASH 820 mA 1.65 V 1.35 V AUTOMOTIVE S-PBGA-B416 Not Qualified 125 °C -40 °C 416 PLASTIC/EPOXY BGA BGA416,26X26,40 SQUARE GRID ARRAY BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS compliant 8542.31.00.01 MPC5566MVR112R
935316969518
NXP Semiconductors
Check for Price Active 32 80 MHz 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER YES YES YES 1.65 V 1.35 V 416 HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS HBGA, unknown 8542.31.00.01
935313983557
NXP Semiconductors
Check for Price Active 32 132 MHz 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER YES YES YES 1.65 V 1.35 V e4 3 260 40 416 HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG NICKEL GOLD BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS HBGA, unknown 8542.31.00.01
935319453557
NXP Semiconductors
Check for Price Active 32 144 MHz 32 24 20 MHz 256 YES 1.5 V MICROCONTROLLER YES YES YES 1.65 V 1.35 V e1 3 260 40 416 HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER COPPER BALL 1 mm BOTTOM 27 mm 27 mm NXP SEMICONDUCTORS HBGA, unknown 8542.31.00.01