1 - 10 of 425,680 results sorted by Number of I/O Lines
Compare | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||
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Part Number |
Composite Price
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Rohs Code
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Part Life Cycle Code
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Bit Size | Speed | ROM (words) | RAM (bytes) |
External Data Bus Width
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Address Bus Width |
Clock Frequency-Max
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Number of I/O Lines |
Surface Mount
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Supply Voltage-Nom |
uPs/uCs/Peripheral ICs Type
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Technology |
Additional Feature
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DAC Channels | DMA Channels | Has ADC |
On Chip Program ROM Width
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Power Supplies
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PWM Channels |
ROM Programmability
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Supply Current-Max
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Supply Voltage-Max
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Supply Voltage-Min
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Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Width
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Length
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Ihs Manufacturer
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Package Description
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Reach Compliance Code
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HTS Code
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Source Content uid
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935319429557
NXP Semiconductors
|
Check for Price | Active | 32 | 132 MHz | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER | YES | YES | YES | 1.65 V | 1.35 V | e1 | 3 | 260 | 40 | 416 | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | NXP SEMICONDUCTORS | HBGA, | unknown | 8542.31.00.01 | |||||||||||||||||||||
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MPC5566MZP112R
NXP Semiconductors
|
Check for Price | No | Active | 32 | 112 MHz | 3145728 | 131072 | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER | CMOS | ADC 40-CH IS AVAILABLE | NO | YES | YES | 8 | 1.5,3.3,5 V | YES | FLASH | 820 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | 125 °C | -40 °C | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEBGA-416 | unknown | 8542.31.00.01 | MPC5566MZP112R | |||||||
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935316969557
NXP Semiconductors
|
Check for Price | Active | 32 | 80 MHz | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER | YES | YES | YES | 1.65 V | 1.35 V | 416 | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | NXP SEMICONDUCTORS | HBGA, | unknown | 8542.31.00.01 | ||||||||||||||||||||||||||
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935317056518
NXP Semiconductors
|
Check for Price | Obsolete | 32 | 112 MHz | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER | YES | YES | YES | 1.65 V | 1.35 V | 416 | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | NXP SEMICONDUCTORS | HBGA, | unknown | 8542.31.00.01 | ||||||||||||||||||||||||||
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935325464557
NXP Semiconductors
|
Check for Price | Active | 32 | 144 MHz | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER | YES | YES | YES | 1.65 V | 1.35 V | 416 | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | NXP SEMICONDUCTORS | HBGA, | unknown | 8542.31.00.01 | ||||||||||||||||||||||||||
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935309958557
NXP Semiconductors
|
Check for Price | Active | 32 | 144 MHz | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER | YES | YES | YES | 1.65 V | 1.35 V | e4 | 3 | 260 | 40 | 416 | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | NICKEL GOLD | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | NXP SEMICONDUCTORS | HBGA, | unknown | 8542.31.00.01 | |||||||||||||||||||||
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MPC5566MVR112R
NXP Semiconductors
|
Check for Price | Yes | Active | 32 | 114 MHz | 3145728 | 131072 | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER, RISC | CMOS | YES | YES | 1.5,3.3,5 V | YES | FLASH | 820 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | 125 °C | -40 °C | 416 | PLASTIC/EPOXY | BGA | BGA416,26X26,40 | SQUARE | GRID ARRAY | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | NXP SEMICONDUCTORS | compliant | 8542.31.00.01 | MPC5566MVR112R | ||||||||||||
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935316969518
NXP Semiconductors
|
Check for Price | Active | 32 | 80 MHz | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER | YES | YES | YES | 1.65 V | 1.35 V | 416 | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | NXP SEMICONDUCTORS | HBGA, | unknown | 8542.31.00.01 | ||||||||||||||||||||||||||
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935313983557
NXP Semiconductors
|
Check for Price | Active | 32 | 132 MHz | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER | YES | YES | YES | 1.65 V | 1.35 V | e4 | 3 | 260 | 40 | 416 | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | NICKEL GOLD | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | NXP SEMICONDUCTORS | HBGA, | unknown | 8542.31.00.01 | |||||||||||||||||||||
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935319453557
NXP Semiconductors
|
Check for Price | Active | 32 | 144 MHz | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER | YES | YES | YES | 1.65 V | 1.35 V | e1 | 3 | 260 | 40 | 416 | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | NXP SEMICONDUCTORS | HBGA, | unknown | 8542.31.00.01 |