1 - 10 of 425,680 results sorted by Supply Voltage-Nom
Compare | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Part Number |
Composite Price
|
Rohs Code
|
Part Life Cycle Code
|
Bus Compatibility |
Surface Mount
|
Supply Voltage-Nom |
uPs/uCs/Peripheral ICs Type
|
Technology |
Temperature Grade
|
JESD-30 Code
|
JESD-609 Code
|
Moisture Sensitivity Level
|
Operating Temperature-Max
|
Operating Temperature-Min
|
Peak Reflow Temperature (Cel)
|
Time@Peak Reflow Temperature-Max (s)
|
Number of Terminals
|
Package Body Material
|
Package Code
|
Package Equivalence Code
|
Package Shape
|
Package Style
|
Terminal Finish
|
Terminal Form
|
Terminal Pitch
|
Terminal Position
|
Seated Height-Max
|
Width
|
Length
|
Ihs Manufacturer
|
Reach Compliance Code
|
HTS Code
|
Date Of Intro
|
Package Description
|
|
XCZU7CG-1LFBVB900I
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | INDUSTRIAL | S-PBGA-B900 | e1 | 4 | 100 °C | -40 °C | 900 | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 1 mm | BOTTOM | 2.88 mm | 31 mm | 31 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||||
|
XCZU2EG-2LSBVA484E
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | OTHER | S-PBGA-B484 | e1 | 4 | 110 °C | 250 | 30 | 484 | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 2.61 mm | 19 mm | 19 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | ||||
|
XCZU4CG-1LSFVC784I
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | INDUSTRIAL | S-PBGA-B784 | e1 | 4 | 100 °C | -40 °C | 250 | 30 | 784 | PLASTIC/EPOXY | FBGA | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 3.32 mm | 23 mm | 23 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||
|
XCZU4EG-1LFBVB900I
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | INDUSTRIAL | S-PBGA-B900 | e1 | 4 | 100 °C | -40 °C | 900 | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 1 mm | BOTTOM | 2.88 mm | 31 mm | 31 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||||
|
XCZU6EG-1LFFVC900I
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | INDUSTRIAL | S-PBGA-B900 | e1 | 4 | 100 °C | -40 °C | 245 | 30 | 900 | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 3.42 mm | 31 mm | 31 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||
|
XCZU7EG-2LFFVC1156E
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | OTHER | S-PBGA-B1156 | e1 | 4 | 110 °C | 245 | 30 | 1156 | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 3.51 mm | 35 mm | 35 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | ||||
|
XCZU7CG-2LFBVB900I
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | INDUSTRIAL | S-PBGA-B900 | e1 | 4 | 100 °C | -40 °C | 245 | 30 | 900 | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 1 mm | BOTTOM | 2.88 mm | 31 mm | 31 mm | XILINX INC | compliant | 8542.31.00.01 | , | |||
|
XCZU3EG-1LSFVA625I
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | INDUSTRIAL | S-PBGA-B625 | e1 | 4 | 100 °C | -40 °C | 250 | 30 | 625 | PLASTIC/EPOXY | FBGA | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 3.43 mm | 21 mm | 21 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||
|
XCZU5CG-2LSFVC784I
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | INDUSTRIAL | S-PBGA-B784 | e1 | 4 | 100 °C | -40 °C | 250 | 30 | 784 | PLASTIC/EPOXY | FBGA | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 3.32 mm | 23 mm | 23 mm | XILINX INC | compliant | 8542.31.00.01 | , | |||
|
XCZU4CG-2LFBVB900I
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | INDUSTRIAL | S-PBGA-B900 | e1 | 4 | 100 °C | -40 °C | 245 | 30 | 900 | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 1 mm | BOTTOM | 2.88 mm | 31 mm | 31 mm | XILINX INC | compliant | 8542.31.00.01 | , |