Parametric results for: R4F24569NVRFQV under Microcontrollers

Filter Your Search
|
-
-
-
-
-
-
-
-
-
-
-

1 - 10 of 425,680 results sorted by Supply Voltage-Nom

Selected entries:
Compare
Compare Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
Part Number Composite Price
Rohs Code
Part Life Cycle Code
Bus Compatibility Surface Mount
Supply Voltage-Nom uPs/uCs/Peripheral ICs Type
Technology Temperature Grade
JESD-30 Code
JESD-609 Code
Moisture Sensitivity Level
Operating Temperature-Max
Operating Temperature-Min
Peak Reflow Temperature (Cel)
Time@Peak Reflow Temperature-Max (s)
Number of Terminals
Package Body Material
Package Code
Package Equivalence Code
Package Shape
Package Style
Terminal Finish
Terminal Form
Terminal Pitch
Terminal Position
Seated Height-Max
Width
Length
Ihs Manufacturer
Reach Compliance Code
HTS Code
Date Of Intro
Package Description
XCZU7CG-1LFBVB900I
AMD Xilinx
Check for Price Yes Active CAN, I2C, SPI, UART YES 850 mV MICROPROCESSOR CIRCUIT CMOS INDUSTRIAL S-PBGA-B900 e1 4 100 °C -40 °C 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 1 mm BOTTOM 2.88 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU2EG-2LSBVA484E
AMD Xilinx
Check for Price Yes Active CAN, I2C, SPI, UART YES 850 mV MICROPROCESSOR CIRCUIT CMOS OTHER S-PBGA-B484 e1 4 110 °C 250 30 484 PLASTIC/EPOXY FBGA BGA484,22X22,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 2.61 mm 19 mm 19 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU4CG-1LSFVC784I
AMD Xilinx
Check for Price Yes Active CAN, I2C, SPI, UART YES 850 mV MICROPROCESSOR CIRCUIT CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU4EG-1LFBVB900I
AMD Xilinx
Check for Price Yes Active CAN, I2C, SPI, UART YES 850 mV MICROPROCESSOR CIRCUIT CMOS INDUSTRIAL S-PBGA-B900 e1 4 100 °C -40 °C 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 1 mm BOTTOM 2.88 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU6EG-1LFFVC900I
AMD Xilinx
Check for Price Yes Active CAN, I2C, SPI, UART YES 850 mV MICROPROCESSOR CIRCUIT CMOS INDUSTRIAL S-PBGA-B900 e1 4 100 °C -40 °C 245 30 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.42 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU7EG-2LFFVC1156E
AMD Xilinx
Check for Price Yes Active CAN, I2C, SPI, UART YES 850 mV MICROPROCESSOR CIRCUIT CMOS OTHER S-PBGA-B1156 e1 4 110 °C 245 30 1156 PLASTIC/EPOXY BGA BGA1156,34X34,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.51 mm 35 mm 35 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU7CG-2LFBVB900I
AMD Xilinx
Check for Price Yes Active CAN, I2C, SPI, UART YES 850 mV MICROPROCESSOR CIRCUIT CMOS INDUSTRIAL S-PBGA-B900 e1 4 100 °C -40 °C 245 30 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 1 mm BOTTOM 2.88 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 ,
XCZU3EG-1LSFVA625I
AMD Xilinx
Check for Price Yes Active CAN, I2C, SPI, UART YES 850 mV MICROPROCESSOR CIRCUIT CMOS INDUSTRIAL S-PBGA-B625 e1 4 100 °C -40 °C 250 30 625 PLASTIC/EPOXY FBGA BGA625,25X25,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 3.43 mm 21 mm 21 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU5CG-2LSFVC784I
AMD Xilinx
Check for Price Yes Active CAN, I2C, SPI, UART YES 850 mV MICROPROCESSOR CIRCUIT CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 ,
XCZU4CG-2LFBVB900I
AMD Xilinx
Check for Price Yes Active CAN, I2C, SPI, UART YES 850 mV MICROPROCESSOR CIRCUIT CMOS INDUSTRIAL S-PBGA-B900 e1 4 100 °C -40 °C 245 30 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 1 mm BOTTOM 2.88 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 ,