Register or Sign In
Parametric » Microcontrollers and Processors » Microcontrollers

Parametric results for: R4F24569NVRFQV under Microcontrollers

Filter Your Search

11 - 20 of 436,666 results

|
436,666 hits
436,666 hits
436,666 hits
-
436,666 hits
436,666 hits
-
436,666 hits
436,666 hits
436,666 hits
436,666 hits
436,666 hits
-
436,666 hits
436,666 hits
436,666 hits
436,666 hits
436,666 hits
436,666 hits
436,666 hits
-
436,666 hits
436,666 hits
-
436,666 hits
436,666 hits
436,666 hits
436,666 hits
436,666 hits
-
436,666 hits
-
436,666 hits
-
436,666 hits
436,666 hits
436,666 hits
-
436,666 hits
-
436,666 hits
436,666 hits
Sorted By: Supply Voltage-Nom
Select parts from the table below to compare.
 Compare
Compare
XCZU4CG-1LSFVC784I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU5CG-2LSFVC784I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 ,
XCZU5EV-1LSFVC784I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 2018-03-09
AM2431BSDGHIALXR
 Texas Instruments 		Check for Price Yes Active 800 MHz YES 850 mV SoC CMOS 895 mV 810 mV S-PBGA-B293 3 125 °C -40 °C 250 293 PLASTIC/EPOXY VFBGA BGA293,21X21,20 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH BALL 500 µm BOTTOM 1 mm 11 mm 11 mm TEXAS INSTRUMENTS INC compliant FCCSP-293
XCZU2CG-2LSFVA625I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B625 100 °C -40 °C 625 PLASTIC/EPOXY FBGA BGA625,25X25,32 SQUARE GRID ARRAY, FINE PITCH BALL 800 µm BOTTOM 3.43 mm 21 mm 21 mm XILINX INC compliant 8542.31.00.01 ,
XCZU5EG-2SFVC784E
 AMD Xilinx 		$1,896.7000 Yes Yes Transferred YES 850 mV PROGRAMMABLE SoC CMOS 876 mV 825 mV OTHER R-PBGA-B784 e1 4 100 °C 250 30 784 PLASTIC/EPOXY BGA BGA784,28X28,32 RECTANGULAR GRID ARRAY TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.39.00.01 2017-02-15 5A002.A.4
XCZU3CG-2LSFVA625E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B625 e1 4 110 °C 250 30 625 PLASTIC/EPOXY FBGA BGA625,25X25,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 3.43 mm 21 mm 21 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU2CG-2LSFVA625E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B625 e1 4 110 °C 250 30 625 PLASTIC/EPOXY FBGA BGA625,25X25,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 3.43 mm 21 mm 21 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU2EG-2LSBVA484E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B484 e1 4 110 °C 250 30 484 PLASTIC/EPOXY FBGA BGA484,22X22,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 2.61 mm 19 mm 19 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU7CG-1LFBVB900I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B900 e1 4 100 °C -40 °C 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 1 mm BOTTOM 2.88 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
Previous12345Next