Parametric results for: R4F24569NVRFQV under Microcontrollers

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Sorted By: Supply Voltage-Nom
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XCZU7EV-2LFFVC1156E
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B1156 e1 4 110 °C 245 30 1156 PLASTIC/EPOXY BGA BGA1156,34X34,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.51 mm 35 mm 35 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU6CG-2LFFVC900I
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B900 100 °C -40 °C 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY BALL 1 mm BOTTOM 3.42 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 ,
XCZU4EG-1SFVC784I
AMD Xilinx
$1,105.0000 Yes Transferred YES 850 mV MICROPROCESSOR CIRCUIT CMOS 876 mV 825 mV INDUSTRIAL R-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL BOTTOM XILINX INC compliant 8542.39.00.01 FCBGA-784 5A002.A.4 XILINX
XCZU5EG-2SFVC784E
AMD Xilinx
$1,896.7000 Yes Yes Transferred YES 850 mV PROGRAMMABLE SoC CMOS 876 mV 825 mV OTHER R-PBGA-B784 e1 4 100 °C 250 30 784 PLASTIC/EPOXY BGA BGA784,28X28,32 RECTANGULAR GRID ARRAY TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.39.00.01 2017-02-15 5A002.A.4 XILINX
XCZU7CG-2LFFVC1156I
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B1156 100 °C -40 °C 1156 PLASTIC/EPOXY BGA BGA1156,34X34,40 SQUARE GRID ARRAY BALL 1 mm BOTTOM 3.51 mm 35 mm 35 mm XILINX INC compliant 8542.31.00.01 ,
XCZU3CG-2LSBVA484I
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B484 100 °C -40 °C 484 PLASTIC/EPOXY FBGA BGA484,22X22,32 SQUARE GRID ARRAY, FINE PITCH BALL 800 µm BOTTOM 2.61 mm 19 mm 19 mm XILINX INC compliant 8542.31.00.01 ,
AM2434BSEFGIALVR
Texas Instruments
Check for Price No Obsolete YES 850 mV SoC CMOS 895 mV 810 mV S-PBGA-B441 125 °C -40 °C 441 PLASTIC/EPOXY HFBGA BGA441,21X21,32 SQUARE GRID ARRAY, HEAT SINK/SLUG, FINE PITCH BALL 800 µm BOTTOM 2.652 mm 17.2 mm 17.2 mm
XCZU5CG-2LFBVB900E
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B900 e1 4 110 °C 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 1 mm BOTTOM 2.88 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU2CG-1LSBVA484I
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B484 e1 4 100 °C -40 °C 250 30 484 PLASTIC/EPOXY FBGA BGA484,22X22,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 2.61 mm 19 mm 19 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU17EG-1LFFVD1760I
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B1760 e1 4 100 °C -40 °C 245 30 1760 PLASTIC/EPOXY BGA BGA1760,42X42,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.71 mm 42.5 mm 42.5 mm XILINX INC compliant 8542.31.00.01 2018-03-09