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Parametric results for: R4F24569NVRFQV under Microcontrollers

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XCZU2EG-1LSFVA625I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B625 e1 4 100 °C -40 °C 250 30 625 PLASTIC/EPOXY FBGA BGA625,25X25,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 3.43 mm 21 mm 21 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU6EG-2LFFVC900E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B900 e1 4 110 °C 245 30 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.42 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
AM2434BSDFHIALXR
 Texas Instruments 		Check for Price Yes Active 800 MHz YES 850 mV SoC CMOS 895 mV 810 mV S-PBGA-B293 3 125 °C -40 °C 250 293 PLASTIC/EPOXY VFBGA BGA293,21X21,20 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH BALL 500 µm BOTTOM 1 mm 11 mm 11 mm TEXAS INSTRUMENTS INC not_compliant FCCSP-293 Texas Instruments
XCZU3EG-2LSFVC784I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 ,
XCZU3CG-2LSBVA484I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B484 100 °C -40 °C 484 PLASTIC/EPOXY FBGA BGA484,22X22,32 SQUARE GRID ARRAY, FINE PITCH BALL 800 µm BOTTOM 2.61 mm 19 mm 19 mm XILINX INC compliant 8542.31.00.01 ,
AM2434BSEFGIALVR
 Texas Instruments 		Check for Price No Obsolete YES 850 mV SoC CMOS 895 mV 810 mV S-PBGA-B441 125 °C -40 °C 441 PLASTIC/EPOXY HFBGA BGA441,21X21,32 SQUARE GRID ARRAY, HEAT SINK/SLUG, FINE PITCH BALL 800 µm BOTTOM 2.652 mm 17.2 mm 17.2 mm
XCZU9CG-2LFFVC900E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B900 e1 4 110 °C 245 30 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.42 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU5EG-1SFVC784I
 AMD Xilinx 		$1,693.9000 Yes Transferred YES 850 mV PROGRAMMABLE SoC CMOS 876 mV 825 mV INDUSTRIAL R-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY BGA BGA784,28X28,32 RECTANGULAR GRID ARRAY TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.39.00.01 FCBGA-784 5A002.A.4
XCZU11EG-2LFFVF1517E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B1517 e1 4 110 °C 245 30 1517 PLASTIC/EPOXY BGA BGA1517,39X39,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.51 mm 40 mm 40 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU2CG-2LSBVA484E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B484 e1 4 110 °C 250 30 484 PLASTIC/EPOXY FBGA BGA484,22X22,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 2.61 mm 19 mm 19 mm XILINX INC compliant 8542.31.00.01 2018-03-09
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