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Parametric results for: R4F24569NVRFQV under Microcontrollers

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XCZU2CG-2LSBVA484E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B484 e1 4 110 °C 250 30 484 PLASTIC/EPOXY FBGA BGA484,22X22,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 2.61 mm 19 mm 19 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU6CG-2LFFVC900E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B900 e1 4 110 °C 245 30 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.42 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU2CG-1LSBVA484I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B484 e1 4 100 °C -40 °C 250 30 484 PLASTIC/EPOXY FBGA BGA484,22X22,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 2.61 mm 19 mm 19 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU17EG-1LFFVD1760I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B1760 e1 4 100 °C -40 °C 245 30 1760 PLASTIC/EPOXY BGA BGA1760,42X42,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.71 mm 42.5 mm 42.5 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU4EG-1LSFVC784I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 2018-03-09
AM2434BSDFHIALXR
 Texas Instruments 		Check for Price Yes Active 800 MHz YES 850 mV SoC CMOS 895 mV 810 mV S-PBGA-B293 3 125 °C -40 °C 250 293 PLASTIC/EPOXY VFBGA BGA293,21X21,20 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH BALL 500 µm BOTTOM 1 mm 11 mm 11 mm TEXAS INSTRUMENTS INC not_compliant FCCSP-293 Texas Instruments
XCZU2EG-1LSFVC784I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU4EG-2LFBVB900E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B900 e1 4 110 °C 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 1 mm BOTTOM 2.88 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU5EG-1LFBVB900I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B900 e1 4 100 °C -40 °C 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 1 mm BOTTOM 2.88 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU5EG-1LSFVC784I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 2018-03-09
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