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TD87C51FC-2
Intel Corporation
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Check for Price | Obsolete | 8 | 12 MHz | 32768 | 256 | 256 | 8051 | 8 | 16 | 12 MHz | 32 | 3 | NO | 5 V | MICROCONTROLLER | CMOS | BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION | NO | NO | NO | FIXED POINT | NO | NO | YES | 2 | 1 | 8 | 8 | YES | UVPROM | 30 mA | 6 V | 4 V | INDUSTRIAL | R-GDIP-T40 | Not Qualified | 85 °C | -40 °C | 40 | CERAMIC, GLASS-SEALED | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 15.24 mm | 52.325 mm | INTEL CORP | DIP | CERDIP-40 | 40 | compliant | 8542.31.00.01 | Smart grid technology | [object Object],[object Object],[object Object] | |||||
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TD87C51FC-24
Intel Corporation
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Check for Price | No | Obsolete | 8 | 24 MHz | 32768 | 256 | 8051 | 8 | 16 | 24 MHz | 32 | NO | 5 V | MICROCONTROLLER | CMOS | NO | NO | NO | NO | UVPROM | 56 mA | 6 V | 4 V | INDUSTRIAL | R-GDIP-T40 | Not Qualified | e0 | 85 °C | -40 °C | 40 | CERAMIC, GLASS-SEALED | QCCJ | DIP40,.6 | SQUARE | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 1.27 mm | DUAL | 4.57 mm | 16.5862 mm | 16.5862 mm | INTEL CORP | DIP | QCCJ, DIP40,.6 | 44 | unknown | 8542.31.00.01 | Smart grid technology | [object Object],[object Object],[object Object] | |||||||||||||
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TD87C51FC-20
Intel Corporation
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Check for Price | Obsolete | 8 | 20 MHz | 32768 | 256 | 8 | 16 | 20 MHz | 32 | 3 | NO | 5 V | MICROCONTROLLER | CMOS | BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION | NO | NO | NO | FIXED POINT | NO | NO | YES | 2 | 1 | 8 | 8 | YES | UVPROM | 47 mA | 6 V | 4 V | INDUSTRIAL | R-GDIP-T40 | Not Qualified | 85 °C | -40 °C | 40 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 15.24 mm | 52.325 mm | INTEL CORP | DIP | CERDIP-40 | 40 | unknown | 8542.31.00.01 | Smart grid technology | [object Object],[object Object],[object Object] |