|
XCZU3EG-2LSFVC784E
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | OTHER | S-PBGA-B784 | e1 | 4 | 110 °C | 250 | 30 | 784 | PLASTIC/EPOXY | FBGA | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 3.32 mm | 23 mm | 23 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||
|
XCZU2CG-2LSFVA625E
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | OTHER | S-PBGA-B625 | e1 | 4 | 110 °C | 250 | 30 | 625 | PLASTIC/EPOXY | FBGA | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 3.43 mm | 21 mm | 21 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||
|
XCZU7EG-2LFFVC1156E
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | OTHER | S-PBGA-B1156 | e1 | 4 | 110 °C | 245 | 30 | 1156 | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 3.51 mm | 35 mm | 35 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||
|
XCZU3CG-2LSFVA625E
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | OTHER | S-PBGA-B625 | e1 | 4 | 110 °C | 250 | 30 | 625 | PLASTIC/EPOXY | FBGA | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 3.43 mm | 21 mm | 21 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||
|
XCZU6EG-1LFFVC900I
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | INDUSTRIAL | S-PBGA-B900 | e1 | 4 | 100 °C | -40 °C | 245 | 30 | 900 | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 3.42 mm | 31 mm | 31 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | ||
|
XCZU2EG-2LSBVA484E
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | OTHER | S-PBGA-B484 | e1 | 4 | 110 °C | 250 | 30 | 484 | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 2.61 mm | 19 mm | 19 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||
|
XCZU7CG-1LFBVB900I
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | INDUSTRIAL | S-PBGA-B900 | e1 | 4 | 100 °C | -40 °C | 900 | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 1 mm | BOTTOM | 2.88 mm | 31 mm | 31 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | ||||
|
XCZU7EV-2LFFVC1156E
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | OTHER | S-PBGA-B1156 | e1 | 4 | 110 °C | 245 | 30 | 1156 | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 3.51 mm | 35 mm | 35 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||
|
XCZU7CG-2LFFVF1517E
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | OTHER | S-PBGA-B1517 | e1 | 4 | 110 °C | 245 | 30 | 1517 | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 3.51 mm | 40 mm | 40 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||
|
XCZU5EV-1LSFVC784I
AMD Xilinx
|
Check for Price | Yes | Active | CAN, I2C, SPI, UART | YES | 850 mV | MICROPROCESSOR CIRCUIT | CMOS | INDUSTRIAL | S-PBGA-B784 | e1 | 4 | 100 °C | -40 °C | 250 | 30 | 784 | PLASTIC/EPOXY | FBGA | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 800 µm | BOTTOM | 3.32 mm | 23 mm | 23 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 |