Parametric results for: microcontroller under Microcontrollers

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Sorted By: Supply Voltage-Nom
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XCZU5CG-2LSFVC784I
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC , compliant 8542.31.00.01
XCZU4CG-1LSFVC784I
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU7CG-2LFFVF1517E
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B1517 e1 4 110 °C 245 30 1517 PLASTIC/EPOXY BGA BGA1517,39X39,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.51 mm 40 mm 40 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU3CG-2LSFVA625E
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B625 e1 4 110 °C 250 30 625 PLASTIC/EPOXY FBGA BGA625,25X25,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 3.43 mm 21 mm 21 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU2CG-2LSFVA625E
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B625 e1 4 110 °C 250 30 625 PLASTIC/EPOXY FBGA BGA625,25X25,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 3.43 mm 21 mm 21 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU2CG-2LSFVA625I
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B625 100 °C -40 °C 625 PLASTIC/EPOXY FBGA BGA625,25X25,32 SQUARE GRID ARRAY, FINE PITCH BALL 800 µm BOTTOM 3.43 mm 21 mm 21 mm XILINX INC , compliant 8542.31.00.01
XAM2434ASFGGAALX
Texas Instruments
Check for Price No Obsolete 32 800 MHz 0 2048000 CORTEX-R5F 32 23 25 MHz 148 16 YES 850 mV MICROCONTROLLER, RISC CMOS YES NO YES FLOATING-POINT YES YES YES 5 1 9 8 YES MROM 895 mV 850 mV INDUSTRIAL S-PBGA-B293 e1 105 °C -40 °C 293 PLASTIC/EPOXY VFBGA BGA293,21X21,20 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH TIN SILVER COPPER BALL 500 µm BOTTOM 1 mm 11 mm 11 mm TEXAS INSTRUMENTS INC
AM2431BSDGHIALXR
Texas Instruments
Check for Price Yes Yes Active 800 MHz YES 850 mV SoC CMOS 895 mV 810 mV S-PBGA-B293 3 125 °C -40 °C 250 293 PLASTIC/EPOXY VFBGA BGA293,21X21,20 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH BALL 500 µm BOTTOM 1 mm 11 mm 11 mm TEXAS INSTRUMENTS INC FCCSP-293 compliant 8542.31.00.01 5A992.C
XCZU7EG-2LFFVC1156E
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B1156 e1 4 110 °C 245 30 1156 PLASTIC/EPOXY BGA BGA1156,34X34,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.51 mm 35 mm 35 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU6EG-1LFFVC900I
AMD Xilinx
Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B900 e1 4 100 °C -40 °C 245 30 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.42 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09