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XCZU19EG-1LFFVE1924I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B1924 e1 4 100 °C -40 °C 245 30 1924 PLASTIC/EPOXY BGA BGA1924,44X44,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.71 mm 45 mm 45 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU7EG-2LFFVC1156E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B1156 e1 4 110 °C 245 30 1156 PLASTIC/EPOXY BGA BGA1156,34X34,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.51 mm 35 mm 35 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU2CG-2LSFVA625I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B625 100 °C -40 °C 625 PLASTIC/EPOXY FBGA BGA625,25X25,32 SQUARE GRID ARRAY, FINE PITCH BALL 800 µm BOTTOM 3.43 mm 21 mm 21 mm XILINX INC compliant 8542.31.00.01 ,
XCZU4CG-2LFBVB900I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B900 e1 4 100 °C -40 °C 245 30 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 1 mm BOTTOM 2.88 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 ,
XCZU6CG-2LFFVC900I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B900 100 °C -40 °C 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY BALL 1 mm BOTTOM 3.42 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 ,
XCZU5CG-2LSFVC784I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 ,
XCZU4EG-1LFBVB900I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B900 e1 4 100 °C -40 °C 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 1 mm BOTTOM 2.88 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
AM2431BSDFHIALVR
 Texas Instruments 		Check for Price Yes Yes Active 800 MHz YES 850 mV SoC CMOS 895 mV 810 mV S-PBGA-B441 3 125 °C -40 °C 250 441 PLASTIC/EPOXY HFBGA BGA441,21X21,32 SQUARE GRID ARRAY, HEAT SINK/SLUG, FINE PITCH BALL 800 µm BOTTOM 2.652 mm 17.2 mm 17.2 mm TEXAS INSTRUMENTS INC compliant 8542.31.00.01 FCBGA-441 5A992.C
XCZU3EG-2LSFVC784E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B784 e1 4 110 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU2EG-2LSBVA484E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B484 e1 4 110 °C 250 30 484 PLASTIC/EPOXY FBGA BGA484,22X22,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 2.61 mm 19 mm 19 mm XILINX INC compliant 8542.31.00.01 2018-03-09
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