Filter Your Search
1 - 10 of 468,931 results
|
XCZU5CG-2LSFVC784I
AMD Xilinx
|
Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | INDUSTRIAL | S-PBGA-B784 | e1 | 4 | 100 °C | -40 °C | 250 | 30 | 784 | PLASTIC/EPOXY | FBGA | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 3.32 mm | 23 mm | 23 mm | XILINX INC | , | compliant | 8542.31.00.01 | ||||||||||||||||||||||||||||||
|
XCZU4CG-1LSFVC784I
AMD Xilinx
|
Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | INDUSTRIAL | S-PBGA-B784 | e1 | 4 | 100 °C | -40 °C | 250 | 30 | 784 | PLASTIC/EPOXY | FBGA | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 3.32 mm | 23 mm | 23 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | ||||||||||||||||||||||||||||||
|
XCZU7CG-2LFFVF1517E
AMD Xilinx
|
Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | OTHER | S-PBGA-B1517 | e1 | 4 | 110 °C | 245 | 30 | 1517 | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 3.51 mm | 40 mm | 40 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||||||||||||||||||||||||||||||
|
XCZU3CG-2LSFVA625E
AMD Xilinx
|
Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | OTHER | S-PBGA-B625 | e1 | 4 | 110 °C | 250 | 30 | 625 | PLASTIC/EPOXY | FBGA | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 3.43 mm | 21 mm | 21 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||||||||||||||||||||||||||||||
|
XCZU2CG-2LSFVA625E
AMD Xilinx
|
Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | OTHER | S-PBGA-B625 | e1 | 4 | 110 °C | 250 | 30 | 625 | PLASTIC/EPOXY | FBGA | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 3.43 mm | 21 mm | 21 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||||||||||||||||||||||||||||||
|
XCZU2CG-2LSFVA625I
AMD Xilinx
|
Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | INDUSTRIAL | S-PBGA-B625 | 100 °C | -40 °C | 625 | PLASTIC/EPOXY | FBGA | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 3.43 mm | 21 mm | 21 mm | XILINX INC | , | compliant | 8542.31.00.01 | |||||||||||||||||||||||||||||||||||
|
XAM2434ASFGGAALX
Texas Instruments
|
Check for Price | No | Obsolete | 32 | 800 MHz | 0 | 2048000 | CORTEX-R5F | 32 | 23 | 25 MHz | 148 | 16 | YES | 850 mV | MICROCONTROLLER, RISC | CMOS | YES | NO | YES | FLOATING-POINT | YES | YES | YES | 5 | 1 | 9 | 8 | YES | MROM | 895 mV | 850 mV | INDUSTRIAL | S-PBGA-B293 | e1 | 105 °C | -40 °C | 293 | PLASTIC/EPOXY | VFBGA | BGA293,21X21,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1 mm | 11 mm | 11 mm | TEXAS INSTRUMENTS INC | ||||||||||||
|
AM2431BSDGHIALXR
Texas Instruments
|
Check for Price | Yes | Yes | Active | 800 MHz | YES | 850 mV | SoC | CMOS | 895 mV | 810 mV | S-PBGA-B293 | 3 | 125 °C | -40 °C | 250 | 293 | PLASTIC/EPOXY | VFBGA | BGA293,21X21,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | BALL | 500 µm | BOTTOM | 1 mm | 11 mm | 11 mm | TEXAS INSTRUMENTS INC | FCCSP-293 | compliant | 8542.31.00.01 | 5A992.C | ||||||||||||||||||||||||||||||
|
XCZU7EG-2LFFVC1156E
AMD Xilinx
|
Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | OTHER | S-PBGA-B1156 | e1 | 4 | 110 °C | 245 | 30 | 1156 | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 3.51 mm | 35 mm | 35 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 | |||||||||||||||||||||||||||||||
|
XCZU6EG-1LFFVC900I
AMD Xilinx
|
Check for Price | Yes | Transferred | CAN, I2C, SPI, UART | YES | 850 mV | PROGRAMMABLE SoC | CMOS | INDUSTRIAL | S-PBGA-B900 | e1 | 4 | 100 °C | -40 °C | 245 | 30 | 900 | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 3.42 mm | 31 mm | 31 mm | XILINX INC | compliant | 8542.31.00.01 | 2018-03-09 |