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Sorted By: Supply Voltage-Nom
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XCZU7CG-1LFBVB900I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B900 e1 4 100 °C -40 °C 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 1 mm BOTTOM 2.88 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU5EV-1LSFVC784I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU3EG-2LSFVC784E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B784 e1 4 110 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU7EV-2LFFVC1156E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B1156 e1 4 110 °C 245 30 1156 PLASTIC/EPOXY BGA BGA1156,34X34,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.51 mm 35 mm 35 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XAM2434ASFGGAALX
 Texas Instruments 		Check for Price No Active 32 800 MHz 0 2048000 CORTEX-R5F 32 23 25 MHz 148 16 YES 850 mV MICROCONTROLLER, RISC CMOS YES NO YES FLOATING-POINT YES YES YES 5 1 9 8 YES MROM 895 mV 810 mV INDUSTRIAL S-PBGA-B293 e1 105 °C -40 °C 293 PLASTIC/EPOXY VFBGA BGA293,21X21,20 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH TIN SILVER COPPER BALL 500 µm BOTTOM 1 mm 11 mm 11 mm
XCZU4EG-1LFBVB900I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B900 e1 4 100 °C -40 °C 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 1 mm BOTTOM 2.88 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
AM2431BSDGHIALXR
 Texas Instruments 		Check for Price Yes Active 800 MHz YES 850 mV SoC CMOS 895 mV 810 mV S-PBGA-B293 3 125 °C -40 °C 250 293 PLASTIC/EPOXY VFBGA BGA293,21X21,20 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH BALL 500 µm BOTTOM 1 mm 11 mm 11 mm TEXAS INSTRUMENTS INC compliant FCCSP-293
XCZU4CG-1LSFVC784I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU5CG-2LSFVC784I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY FBGA BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.31.00.01 ,
XCZU7CG-2LFFVF1517E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B1517 e1 4 110 °C 245 30 1517 PLASTIC/EPOXY BGA BGA1517,39X39,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.51 mm 40 mm 40 mm XILINX INC compliant 8542.31.00.01 2018-03-09
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