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QU80386EXTC33
Intel Corporation
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$0.3110 | Yes | Obsolete | 32 | 33 MHz | 0 | 16 | 26 | 25 MHz | YES | 5 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | NO | YES | 2 | 12 | 3 | 320 mA | 5.5 V | 4.5 V | S-PQFP-G132 | Not Qualified | 117 °C | -40 °C | 132 | PLASTIC/EPOXY | BQFP | SPQFP132,1.1SQ | SQUARE | FLATPACK, BUMPER | GULL WING | 635 µm | QUAD | 4.57 mm | 24.13 mm | 24.13 mm | INTEL CORP | TQFP-144 | unknown | 8542.31.00.01 | Intel | |||||||||||||||||||
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MPC8548CVTAQGD
Freescale Semiconductor
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$0.3167 | No | Yes | Obsolete | YES | 1.1 V | SoC | CMOS | 1.155 V | 1.045 V | S-PBGA-B783 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 260 | 40 | 783 | PLASTIC/EPOXY | BGA | BGA783,28X28,40 | SQUARE | GRID ARRAY | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 3.38 mm | 29 mm | 29 mm | FREESCALE SEMICONDUCTOR INC | BGA-783 | not_compliant | 8542.31.00.01 | 3A991.A.2 | |||||||||||||||||||||||||||
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P1024NSN5DFB
NXP Semiconductors
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$0.5310 | Yes | Obsolete | MICROPROCESSOR, RISC | CMOS | e2 | 3 | 260 | 40 | Tin/Silver (Sn/Ag) | NXP SEMICONDUCTORS | compliant | 8542.31.00.01 | 3A991.A.2 | |||||||||||||||||||||||||||||||||||||||||||||||||
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MC8640DTVU1067NE
Freescale Semiconductor
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$0.5323 | No | Yes | Obsolete | 32 | 1.067 GHz | 32 | 32 | 166.66 MHz | YES | 950 mV | MICROPROCESSOR | CMOS | YES | FLOATING POINT | YES | YES | 1 V | 900 mV | INDUSTRIAL | S-CBGA-B1023 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 245 | 30 | 1023 | CERAMIC, METAL-SEALED COFIRED | BGA | BGA1023,32X32,40 | SQUARE | GRID ARRAY | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 2.97 mm | 33 mm | 33 mm | FREESCALE SEMICONDUCTOR INC | 33 X 33 MM, ROHS COMPLIANT, CERAMIC, FCBGA-1023 | not_compliant | 8542.31.00.01 | 3A991.A.1 | BGA | 1023 | |||||||||||||||
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MC9S08PT8VLC
NXP Semiconductors
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$0.6856 | Yes | Not Recommended | 8 | 20 MHz | 8192 | 2048 | HCS08 | YES | MICROPROCESSOR, RISC | CMOS | FLASH | 14 mA | INDUSTRIAL | S-PQFP-G32 | Not Qualified | e3 | 3 | 105 °C | -40 °C | 260 | 40 | 32 | PLASTIC/EPOXY | QFP | QFP32,.35SQ,32 | SQUARE | FLATPACK | Tin (Sn) | GULL WING | 800 µm | QUAD | NXP SEMICONDUCTORS | compliant | 8542.31.00.01 | NXP | 3A991.A.2 | ||||||||||||||||||||||||||
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FS32R372SDK0MMM
NXP Semiconductors
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$1.0000 | Obsolete | 32 | 240 MHz | 1048576 | 40 MHz | YES | 1.25 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 32 | 1 | 8 | 1.1 A | 1.31 V | 1.19 V | S-PBGA-B257 | 125 °C | -40 °C | ISO 26262 | 257 | PLASTIC/EPOXY | LFBGA | BGA257,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.51 mm | 14 mm | 14 mm | NXP SEMICONDUCTORS | unknown | 8542.31.00.01 | 3A991.A.2 | 2018-08-24 | ||||||||||||||||||||||
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P2020NSN2NHC
NXP Semiconductors
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$1.0000 | Yes | Obsolete | 1.333 GHz | 64 | 16 | YES | 1.05 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | NO | 4 | 7 | 1.1 V | 1 V | S-PBGA-B689 | e2 | 3 | 260 | 40 | 689 | PLASTIC/EPOXY | BGA | BGA689,29X29,40 | SQUARE | GRID ARRAY | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 2.46 mm | 31 mm | 31 mm | NXP SEMICONDUCTORS | TEBGA-689 | compliant | 8542.31.00.01 | NXP | 3A991.A.2 | |||||||||||||||||||||
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SAM9X70-I/4PB
Microchip Technology Inc
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$1.0000 | Active | 32 | 800 MHz | 69632 | 16 | 23 | 50 MHz | YES | MICROPROCESSOR | CMOS | YES | FIXED POINT | YES | YES | 16 | 1 | 13 | 8 | 3 mA | 1.21 V | 1.14 V | S-PBGA-B240 | 85 °C | -40 °C | 240 | PLASTIC/EPOXY | LFBGA | BGA240,16X16,25 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 650 µm | BOTTOM | MICROCHIP TECHNOLOGY INC | unknown | 8542.31.00.01 | Microchip | 3A991.A.2 | ||||||||||||||||||||||||
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MPC8548VJAQGD
NXP Semiconductors
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$1.0000 | Yes | Obsolete | YES | 1.1 V | SoC | CMOS | 1.155 V | 1.045 V | S-PBGA-B783 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 260 | 40 | 783 | PLASTIC/EPOXY | BGA | BGA783,28X28,40 | SQUARE | GRID ARRAY | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 3.38 mm | 29 mm | 29 mm | NXP SEMICONDUCTORS | BGA-783 | compliant | 8542.31.00.01 | NXP | 3A991.A.2 | |||||||||||||||||||||||||||
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MPC8536EBVJATHA
NXP Semiconductors
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$1.0000 | Yes | Obsolete | 32 | 1.25 GHz | 64 | 16 | 133 MHz | YES | 1 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 1.05 V | 950 mV | S-PBGA-B783 | Not Qualified | e2 | 3 | 260 | 40 | 783 | PLASTIC/EPOXY | HBGA | BGA783,28X28,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 2.76 mm | 29 mm | 29 mm | NXP SEMICONDUCTORS | 29 X 29 MM, 2.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783 | compliant | 8542.31.00.01 | 5A002.A.1 |